Late-Write SRAM, 32KX36, 4ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Motorola ( NXP ) |
package instruction | 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.A |
Maximum access time | 4 ns |
Other features | BYTE WRITE CONTROL; BOUNDARY SCAN |
I/O type | COMMON |
JESD-30 code | R-PBGA-B119 |
JESD-609 code | e0 |
length | 22 mm |
memory density | 1179648 bit |
Memory IC Type | LATE-WRITE SRAM |
memory width | 36 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 119 |
word count | 32768 words |
character code | 32000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX36 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA119,7X17,50 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 1.5,3.3 V |
Certification status | Not Qualified |
Maximum seat height | 2.4 mm |
Minimum standby current | 3.15 V |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3.15 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | BICMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |
MCM69R536ZP8 | MCM69R536ZP5R | MCM69R618ZP7 | MCM69R618ZP8 | MCM69R618ZP6R | MCM69R618ZP7R | MCM69R618ZP5 | MCM69R618ZP5R | MCM69R536ZP6R | MCM69R536ZP6 | |
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Description | Late-Write SRAM, 32KX36, 4ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | Late-Write SRAM, 32KX36, 2.5ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | Late-Write SRAM, 64KX18, 3.5ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | Late-Write SRAM, 64KX18, 4ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | Late-Write SRAM, 64KX18, 3ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | Late-Write SRAM, 64KX18, 3.5ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | Late-Write SRAM, 64KX18, 2.5ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | Late-Write SRAM, 64KX18, 2.5ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | Late-Write SRAM, 32KX36, 3ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | Late-Write SRAM, 32KX36, 3ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
package instruction | 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 4 ns | 2.5 ns | 3.5 ns | 4 ns | 3 ns | 3.5 ns | 2.5 ns | 2.5 ns | 3 ns | 3 ns |
Other features | BYTE WRITE CONTROL; BOUNDARY SCAN | BYTE WRITE CONTROL; BOUNDARY SCAN | BYTE WRITE CONTROL; BOUNDARY SCAN | BYTE WRITE CONTROL; BOUNDARY SCAN | BYTE WRITE CONTROL; BOUNDARY SCAN | BYTE WRITE CONTROL; BOUNDARY SCAN | BYTE WRITE CONTROL; BOUNDARY SCAN | BYTE WRITE CONTROL; BOUNDARY SCAN | BYTE WRITE CONTROL; BOUNDARY SCAN | BYTE WRITE CONTROL; BOUNDARY SCAN |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm |
memory density | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit | 1179648 bit |
Memory IC Type | LATE-WRITE SRAM | LATE-WRITE SRAM | LATE-WRITE SRAM | LATE-WRITE SRAM | LATE-WRITE SRAM | LATE-WRITE SRAM | LATE-WRITE SRAM | LATE-WRITE SRAM | LATE-WRITE SRAM | LATE-WRITE SRAM |
memory width | 36 | 36 | 18 | 18 | 18 | 18 | 18 | 18 | 36 | 36 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 119 | 119 | 119 | 119 | 119 | 119 | 119 | 119 | 119 | 119 |
word count | 32768 words | 32768 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 32768 words | 32768 words |
character code | 32000 | 32000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 32000 | 32000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 32KX36 | 32KX36 | 64KX18 | 64KX18 | 64KX18 | 64KX18 | 64KX18 | 64KX18 | 32KX36 | 32KX36 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Exportable | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
Encapsulate equivalent code | BGA119,7X17,50 | BGA119,7X17,50 | BGA119,7X17,50 | BGA119,7X17,50 | BGA119,7X17,50 | BGA119,7X17,50 | BGA119,7X17,50 | BGA119,7X17,50 | BGA119,7X17,50 | BGA119,7X17,50 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V | 1.5,3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 2.4 mm | 2.4 mm | 2.4 mm | 2.4 mm | 2.4 mm | 2.4 mm | 2.4 mm | 2.4 mm | 2.4 mm | 2.4 mm |
Minimum standby current | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |