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DM77SR474BJ/883

Description
IC,PROM,512X8,TTL,DIP,24PIN,CERAMIC
Categorystorage    storage   
File Size265KB,4 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric

DM77SR474BJ/883 Overview

IC,PROM,512X8,TTL,DIP,24PIN,CERAMIC

DM77SR474BJ/883 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionDIP, DIP24,.3
Reach Compliance Codecompliant
JESD-30 codeR-XDIP-T24
JESD-609 codee0
memory density4096 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count512 words
character code512
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512X8
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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