Memory IC, TTL, PDIP16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Fairchild |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T16 |
JESD-609 code | e0 |
Number of terminals | 16 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
DM9338N | 93L38PCQR | 9338PCQM | 9338PCQR | 93L38DCQM | 93L38FCQM | |
---|---|---|---|---|---|---|
Description | Memory IC, TTL, PDIP16 | Shift Register, | Shift Register, | Shift Register, | Shift Register, | Shift Register, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | unknown | compliant | compliant | compliant | compliant | compliant |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Maker | Fairchild | - | Fairchild | Fairchild | Fairchild | Fairchild |
Is it lead-free? | - | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | 250 | 250 | NOT SPECIFIED | NOT SPECIFIED |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED |