IC PARALLEL, WORD INPUT LOADING, 12-BIT DAC, CDIP24, 0.300 INCH, CERDIP-24, Digital to Analog Converter
Parameter Name | Attribute value |
Maker | ADI |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 24 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum analog output voltage | 5 V |
Minimum analog output voltage | -5 V |
Converter type | D/A CONVERTER |
Enter bit code | OFFSET BINARY |
Input format | PARALLEL, WORD |
JESD-30 code | R-GDIP-T24 |
Maximum linear error (EL) | 0.024% |
Number of digits | 12 |
Number of functions | 1 |
Number of terminals | 24 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum stabilization time | 10 µs |
Maximum slew rate | 12 mA |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
AD7245ASQ | AD7248ASQ | AD7245ASE | |
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Description | IC PARALLEL, WORD INPUT LOADING, 12-BIT DAC, CDIP24, 0.300 INCH, CERDIP-24, Digital to Analog Converter | IC PARALLEL, 8 BITS INPUT LOADING, 12-BIT DAC, CDIP20, 0.300 INCH, CERDIP-20, Digital to Analog Converter | IC PARALLEL, WORD INPUT LOADING, 12-BIT DAC, CQCC28, CERAMIC, LCC-28, Digital to Analog Converter |
Parts packaging code | DIP | DIP | QLCC |
package instruction | DIP, | 0.300 INCH, CERDIP-20 | QCCN, |
Contacts | 24 | 20 | 28 |
Reach Compliance Code | unknown | compliant | unknown |
ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
Maximum analog output voltage | 5 V | 5 V | 5 V |
Minimum analog output voltage | -5 V | -5 V | -5 V |
Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
Enter bit code | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
Input format | PARALLEL, WORD | PARALLEL, 8 BITS | PARALLEL, WORD |
JESD-30 code | R-GDIP-T24 | R-GDIP-T20 | S-CQCC-N28 |
Maximum linear error (EL) | 0.024% | 0.024% | 0.024% |
Number of digits | 12 | 12 | 12 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 24 | 20 | 28 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | QCCN |
Package shape | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | IN-LINE | IN-LINE | CHIP CARRIER |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 5.08 mm | 2.54 mm |
Maximum stabilization time | 10 µs | 10 µs | 10 µs |
Maximum slew rate | 12 mA | 12 mA | 12 mA |
surface mount | NO | NO | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | QUAD |
width | 7.62 mm | 7.62 mm | 11.43 mm |
Maker | ADI | - | ADI |