Telecom Circuit, 1-Func, CMOS, DIE-11
Parameter Name | Attribute value |
Maker | Mindspeed Technologies Inc |
Parts packaging code | DIE |
package instruction | DIE, |
Contacts | 11 |
Reach Compliance Code | compliant |
JESD-30 code | R-XUUC-N11 |
Number of functions | 1 |
Number of terminals | 11 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Package shape | RECTANGULAR |
Package form | UNCASED CHIP |
Certification status | Not Qualified |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Telecom integrated circuit types | TELECOM CIRCUIT |
Temperature level | INDUSTRIAL |
Terminal form | NO LEAD |
Terminal location | UPPER |
MC2010SDIEWP | MC2010LDIEWP | MC2010LWAFER | MC2010SWAFER | |
---|---|---|---|---|
Description | Telecom Circuit, 1-Func, CMOS, DIE-11 | Telecom Circuit, 1-Func, CMOS, DIE-11 | Telecom Circuit, 1-Func, CMOS, WAFER-11 | Telecom Circuit, 1-Func, CMOS, WAFER-11 |
Maker | Mindspeed Technologies Inc | Mindspeed Technologies Inc | Mindspeed Technologies Inc | Mindspeed Technologies Inc |
Parts packaging code | DIE | DIE | WAFER | WAFER |
package instruction | DIE, | DIE, | DIE, | DIE, |
Contacts | 11 | 11 | 11 | 11 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
JESD-30 code | R-XUUC-N11 | R-XUUC-N11 | R-XUUC-N11 | R-XUUC-N11 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 11 | 11 | 11 | 11 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIE | DIE | DIE | DIE |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Telecom integrated circuit types | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | UPPER | UPPER | UPPER | UPPER |