|
MA808DG |
MA808DP |
Description |
PCM Receiver, CEPT PCM-30/E-1, CMOS, CDIP24, |
PCM Receiver, CEPT PCM-30/E-1, CMOS, PDIP24, |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
Zarlink Semiconductor (Microsemi) |
Zarlink Semiconductor (Microsemi) |
package instruction |
DIP, DIP24,.6 |
DIP, DIP24,.6 |
Reach Compliance Code |
unknown |
unknown |
Carrier type |
CEPT PCM-30/E-1 |
CEPT PCM-30/E-1 |
data rate |
2048 Mbps |
2048 Mbps |
JESD-30 code |
R-XDIP-T24 |
R-PDIP-T24 |
JESD-609 code |
e0 |
e0 |
Number of terminals |
24 |
24 |
Maximum operating temperature |
55 °C |
55 °C |
Minimum operating temperature |
-10 °C |
-10 °C |
Package body material |
CERAMIC |
PLASTIC/EPOXY |
encapsulated code |
DIP |
DIP |
Encapsulate equivalent code |
DIP24,.6 |
DIP24,.6 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
IN-LINE |
power supply |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum slew rate |
15 mA |
15 mA |
Nominal supply voltage |
5 V |
5 V |
surface mount |
NO |
NO |
technology |
CMOS |
CMOS |
Telecom integrated circuit types |
PCM RECEIVER |
PCM RECEIVER |
Temperature level |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |