HC/UH SERIES, 8-BIT ENCODER, CDIP16, FRIT SEALED, CERAMIC, DIP-16
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | STMicroelectronics |
Parts packaging code | DIP |
package instruction | DIP, DIP16,.3 |
Contacts | 16 |
Reach Compliance Code | not_compliant |
M54HC148F1 | M74HC148M1 | M74HC148B1N | M74HC148F1 | M74HC148C1 | |
---|---|---|---|---|---|
Description | HC/UH SERIES, 8-BIT ENCODER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, 8-BIT ENCODER, PDSO16, MICRO, PLASTIC, DIP-16 | HC/UH SERIES, 8-BIT ENCODER, PDIP16, PLASTIC, DIP-16 | HC/UH SERIES, 8-BIT ENCODER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, 8-BIT ENCODER, PQCC20, PLASTIC, CC-20 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
Parts packaging code | DIP | SOIC | DIP | DIP | QFN |
package instruction | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ |
Contacts | 16 | 16 | 16 | 16 | 20 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
Other features | - | 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT | 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT | 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT | 8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT |
series | - | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 code | - | R-PDSO-G16 | R-PDIP-T16 | R-GDIP-T16 | S-PQCC-J20 |
JESD-609 code | - | e0 | e0 | e0 | e0 |
Load capacitance (CL) | - | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | - | ENCODER | ENCODER | ENCODER | ENCODER |
Number of digits | - | 8 | 8 | 8 | 8 |
Number of functions | - | 1 | 1 | 1 | 1 |
Number of terminals | - | 16 | 16 | 16 | 20 |
Maximum operating temperature | - | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | - | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
encapsulated code | - | SOP | DIP | DIP | QCCJ |
Encapsulate equivalent code | - | SOP16,.25 | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ |
Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | - | SMALL OUTLINE | IN-LINE | IN-LINE | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | - | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
propagation delay (tpd) | - | 41 ns | 41 ns | 41 ns | 41 ns |
Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | - | 1.75 mm | 5.1 mm | 5 mm | 4.57 mm |
Maximum supply voltage (Vsup) | - | 6 V | 6 V | 6 V | 6 V |
Minimum supply voltage (Vsup) | - | 2 V | 2 V | 2 V | 2 V |
Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V |
surface mount | - | YES | NO | NO | YES |
technology | - | CMOS | CMOS | CMOS | CMOS |
Temperature level | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | J BEND |
Terminal pitch | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | - | DUAL | DUAL | DUAL | QUAD |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | - | 3.9 mm | 7.62 mm | 7.62 mm | 8.9662 mm |