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MS235RAG19NGSP

Description
General Purpose Inductor, 0.019uH, 2%, 1 Element, Ceramic-Core, SMD, CHIP, 0402
CategoryPassive components    inductor   
File Size183KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

MS235RAG19NGSP Overview

General Purpose Inductor, 0.019uH, 2%, 1 Element, Ceramic-Core, SMD, CHIP, 0402

MS235RAG19NGSP Parametric

Parameter NameAttribute value
MakerCOILCRAFT
Reach Compliance Codeunknown
ECCN codeEAR99
core materialCERAMIC
DC Resistance0.145 Ω
Nominal inductance(L)0.019 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Manufacturer's serial numberMS235RAG
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
self resonant frequency3500 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTIN LEAD
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency250 MHz
Tolerance2%
0402 CHIP INDUCTORS
MilitaryGradeChipInductors
MS235RAG
Higher Q and lower DCR than other 0402 inductors
Very high SRF values – as high as 16 GHz
Excellent current handling capability – up to 2300 mA
52 inductance values from 1.0 to 220 nH
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Weight
0.7 – 1.0 mg
Ambient temperature
–55°C to +140°C with
Irms
current, +140°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +125 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel.
Paper tape: 8 mm wide, 0.66 mm thick, 2 mm pocket spacing
This robust version of Coilcraft’s standard 0402HP
series features high temperature materials that allow
operation in ambient temperatures up to 155°C and a
leach-resistant base metalization with tin-lead (Sn-Pb)
terminations that ensures the best possible board
adhesion.
B
overall
C
D
H
I
J
I
F
A
Current Derating
120
110
100
G
F
Percent of rated
I
rms
E
terminal
Terminal wraparound:
approx 0.007/0,18 both ends
Suggested
Land Pattern
C max
0.024
0,61
C max
0.026
0,66
I
0.014
0,36
90
80
70
60
50
1–51 nH
A max
0.043
1,09
A max
0.044
1,12
F
0.008
0,20
B
0.026 ±0.002
0,66 ±0,051
B
0.026 ±0.002
0,66 ±0,051
G
0.024
0,61
H
0.026
0,66
inches
mm
inches
mm
J
0.020
0,51
inches
mm
30
20
10
0
-40
-20
0
20
56–220 nH
D
0.010
0,25
E
0.020
0,51
25°C
40
40
60
80
100
120
140 160
Ambient temperature (°C)
Typical L vs Frequency
80
70
68 nH
51 nH
Typical Q vs Frequency
120
110
100
90
80
70
60
50
40
30
20
10
0
1
10
100
1000
2.0 nH
11 nH
27 nH
39 nH
51 nH
68 nH
Inductance (nH)
60
50
39 nH
40
30
20
10
0
1
10
100
1000
11 nH
2.0 nH
27 nH
Q Factor
10000
10000
Frequency (MHz)
®
Frequency (MHz)
Revised 06/25/09
These parts are preproduction products for electrical evaluation only.
Specification subject to change without notice.
Document MS526-1
1102 Silver Lake Road
Cary IL 60013
© Coilcraft, Inc. 2009
Phone
800-981-0363
Fax
847-639-1508
E-mail
cp@coilcraft.com
Web
www.coilcraft-cps.com

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