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DPS1MX8MKN3-30I

Description
SRAM Module, 1MX8, 30ns, CMOS, CDMA32, 0.600 INCH, DIP-32
Categorystorage    storage   
File Size549KB,6 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPS1MX8MKN3-30I Overview

SRAM Module, 1MX8, 30ns, CMOS, CDMA32, 0.600 INCH, DIP-32

DPS1MX8MKN3-30I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerB&B Electronics Manufacturing Company
Parts packaging codeMODULE
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time30 ns
I/O typeCOMMON
JESD-30 codeR-CDMA-T32
JESD-609 codee0
memory density8388608 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of ports1
Number of terminals32
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX8
Output characteristics3-STATE
ExportableNO
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum standby current0.0016 A
Minimum standby current2 V
Maximum slew rate0.24 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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