K6F4016U4D-FF700 datasheet, PDF

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K6F4016U4D-FF700: DescriptionStandard SRAM, 256KX16, 70ns, CMOS, PBGA48, 6.10 X 8.50 MM, 0.75 MM PITCH, FBGA-48; Categorystorage storage; File Size160KB，9 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K6F4016U4D-FF700 Overview

Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 6.10 X 8.50 MM, 0.75 MM PITCH, FBGA-48

K6F4016U4D-FF700 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	48
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	70 ns
JESD-30 code	R-PBGA-B48
length	8.5 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
width	6.1 mm

K6F4016U4D-FF700 Related Products

	K6F4016U4D-FF700	K6F4016U4D-FF70	K6F4016U4D-FF55
Description	Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 6.10 X 8.50 MM, 0.75 MM PITCH, FBGA-48	Standard SRAM, 256KX16, 70ns, CMOS, PBGA48, 6.10 X 8.50 MM, 0.75 MM PITCH, FBGA-48	Standard SRAM, 256KX16, 55ns, CMOS, PBGA48, 6.10 X 8.50 MM, 0.75 MM PITCH, FBGA-48
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	BGA	BGA	BGA
package instruction	TFBGA,	TFBGA, BGA48,6X8,30	TFBGA, BGA48,6X8,30
Contacts	48	48	48
Reach Compliance Code	compliant	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	70 ns	70 ns	55 ns
JESD-30 code	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48
length	8.5 mm	8.5 mm	8.5 mm
memory density	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	16	16
Number of functions	1	1	1
Number of terminals	48	48	48
word count	262144 words	262144 words	262144 words
character code	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
organize	256KX16	256KX16	256KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
width	6.1 mm	6.1 mm	6.1 mm
I/O type	-	COMMON	COMMON
JESD-609 code	-	e0	e0
Output characteristics	-	3-STATE	3-STATE
Encapsulate equivalent code	-	BGA48,6X8,30	BGA48,6X8,30
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED
power supply	-	3 V	3 V
Maximum standby current	-	0.000003 A	0.000003 A
Minimum standby current	-	1.5 V	1.5 V
Maximum slew rate	-	0.04 mA	0.04 mA
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED

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