Multi-Port SRAM, 2KX8, 30ns, CMOS, CPGA108, CAVITY-UP, CERAMIC, PGA-108
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | PGA |
package instruction | PGA, |
Contacts | 108 |
Reach Compliance Code | compliant |
ECCN code | 3A001.A.2.C |
Maximum access time | 30 ns |
Other features | AUTOMATIC POWER-DOWN |
JESD-30 code | S-CPGA-P108 |
JESD-609 code | e3 |
length | 30.48 mm |
memory density | 16384 bit |
Memory IC Type | MULTI-PORT SRAM |
memory width | 8 |
Number of functions | 1 |
Number of ports | 4 |
Number of terminals | 108 |
word count | 2048 words |
character code | 2000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 2KX8 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 5.207 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Matte Tin (Sn) |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
Maximum time at peak reflow temperature | 30 |
width | 30.48 mm |