SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
HF
RoHS
Pb
GREEN
SP3002 Lead-Free/Green Series
Description
The SP3002 has ultra low capacitance rail-to-rail diodes
with an additional zener diode fabricated in a proprietary
silicon avalanche technology to protect each I/O pin
providing a high level of protection for electronic equipment
that may experience destructive electrostatic discharges
(ESD). These robust diodes can safely absorb repetitive
ESD strikes at the maximum level (Level 4) specified in the
IEC 61000-4-2 international standard without performance
degradation. Their very low loading capacitance also makes
them ideal for protecting high speed signal pins such as
HDMI, DVI, USB2.0, and IEEE 1394.
Pinout
I/O 1
I/O 4
I/O 1
NC
I/O 2
1
2
3
Gnd
6
5
4
I/O 4
V CC
I/O 3
features
• ow capacitance of
L
0.85 pF (TYP) per I/O
• SD protection of
E
±12kV contact discharge,
±15kV air discharge,
(IEC61000-4-2)
• FT protection,
E
IEC61000-4-4, 40A
(5/50ns)
Applications
I/O4
• ow leakage current of
L
0.5μA (MAX) at 5V
• Small packaging options
saves board space
• ightning Protection,
L
IEC61000-4-5, 4.5A
(8/20µs)
GND
V
CC
I/O 2
SC70-6 and SOT23-6
I/O 3
uDFN-6
(1.6x1.6x0.5mm)
functional block Diagram
I/O2
V
CC
• Computer Peripherals
• Mobile Phones
• PDA’s
• Digital Cameras
• Network Hardware/Ports
• Test Equipment
• Medical Equipment
I/O1
GND
I/O3
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
43
SP3002 lead-free/Green Series
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Absolute Maximum Ratings
Symbol
I
PP
T
OP
T
STOR
Peak Current (t
p
=8/20μs)
Operating Temperature
Storage Temperature
Parameter
Value
4.5
-40 to 85
-50 to 150
Units
A
°C
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature (Soldering 10s)
Rating
-65 to 150
150
260
Units
°C
°C
°C
electrical characteristics
(T
oP
=25ºc)
Parameter
Reverse Standoff Voltage
Reverse Leakage Current
Clamp Voltage
1
Symbol
V
RWM
I
LEAK
V
C
Test Conditions
I
R
≤ 1µA
V
R
=5V
I
PP
=1A, t
p
=8/20µs, Fwd
I
PP
=2A, t
p
=8/20µs, Fwd
IEC61000-4-2 (Contact)
IEC61000-4-2 (Air)
Reverse Bias=0V
Reverse Bias=1.65V
Reverse Bias=0V
±12
±15
0.95
0.7
1.1
0.85
0.5
1.25
1.0
9.5
10.6
Min
Typ
Max
6.0
0.5
11.0
13.0
Units
V
µA
V
V
kV
kV
pF
pF
pF
ESD Withstand Voltage
1
V
ESD
Diode Capacitance
1
Diode Capacitance
1
C
I/O-GND
C
I/O-I/O
Note 1: Parameter is guaranteed by design and/or device characterization.
SP3002 lead-free/Green Series
44
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Insertion loss (S21) I/o to GnD
0
capacitance vs. bias Voltage
1.50
1.40
1.30
Insertion Loss [dB]
-5
I/O Capacitance (pF)
1.20
1.10
1.00
0.90
0.80
0.70
0.60
V
CC
= 3.3V
V
CC
= Float
-10
-15
V
CC
= 5V
-20
1.E+06
0.50
1.E+07
1.E+08
1.E+09
1.E+10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Frequency [Hz]
I/O DC Bias (V)
capacitance vs. frequency
2E-12
1.8E-12
1.6E-12
1.4E-12
Capacitance [F]
1.2E-12
1E-12
8E-13
6E-13
4E-13
2E-13
0
1.E+06
1.E+07
1.E+08
1.E+09
Frequency [Hz]
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
45
SP3002 lead-free/Green Series
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Application example
+5V
D2+
D2-
5
4
SP300x-04
1
2
3
6
D2+
Gnd
D2-
D1+
D1-
HDMI
or DVI
Interface
IC
D0+
D0-
5
4
SP300x-04
1
2
3
6
D1+
Gnd
D1-
HDMI
or DVI
Connector
D0+
Gnd
D0-
Clk+
Clk-
Clk+
Gnd
Clk-
Gnd
HDMI or DVI application example for the Littelfuse
SP300x-04 protection devices. A single 4 channel
SP300x-04 device can be used to protect four of the data
lines in a HDMI/DVI interface. Two (2) SP300x-04 devices
provide protection for the main data lines. Low voltage
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
T
S(max)
to T
L
- Ramp-up Rate
Reflow
- Temperature (T
L
) (Liquidus)
- Temperature (t
L
)
Pb – Free assembly
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
250
+0/-5
°C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
ASIC HDMI/DVI drivers can also be protected with the
SP300x-04, the +V
CC
pins on the SP300x-04 can be
substituted with a suitable bypass capacitor or in some
backdrive applications the +V
CC
of the SP300x-04 can be
floated or NC.
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
SP3002 lead-free/Green Series
46
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions - Sc70-6
e
6
5
e
4
E
1
B
D
A2 A
2
3
HE
Package
Pins
JEDEC
Min
A
A1
A2
b
c
D
Solder Pad Layout
L
SC70-6
6
MO-203 Issue A
Millimeters
Max
1.10
0.10
1.00
0.30
0.25
2.25
1.35
2.40
0.46
Min
0.031
0.000
0.028
0.006
0.003
0.073
0.045
0.079
0.010
0.80
0.00
0.70
0.15
0.08
1.85
1.15
2.00
0.26
Inches
Max
0.043
0.004
0.039
0.012
0.010
0.089
0.053
0.094
0.018
A1
C
e
e
He
l
0.65 BSC
0.026 BSC
Package Dimensions - SoT23-6
Package
Pins
JEDEC
Millimeters
Min
A
A1
A2
b
c
D
e
e1
e
e1
l
n
a
M
o
P
R
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
SOT23-6
6
MO-203 Issue A
Inches
Min
0.035
0.000
0.035
0.0138
0.0031
0.11
0.102
0.06
Max
0.057
0.006
0.051
0.0196
0.009
0.118
0.118
0.069
Notes
-
-
-
-
-
3
-
3
-
-
4,5
6
10º
0.102
.027 TYP
.039 TYP
0.038
-
-
-
-
-
Max
1.450
0.150
1.300
0.500
0.220
3.000
3.000
1.750
1.9 Ref
0.900
0.000
0.900
0.350
0.080
2.800
2.600
1.500
0.95 Ref
0.100
6
0º
10º
2.590
0.690
0.990
0.950
0º
0.600
0.0374 Ref
0.0748 Ref
0.004
6
0.023
Recommended Solder Pad Layout
M
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L is the length of flat foot surface for soldering to substrate.
”
P
R
O
6. “N” is the number of terminal positions.
7
.
Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
47
SP3002 lead-free/Green Series
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