Standard SRAM, 32KX8, 85ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Hitachi (Renesas ) |
Parts packaging code | SOIC |
package instruction | SOP, SOP28,.5 |
Contacts | 28 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 85 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-G28 |
JESD-609 code | e0 |
length | 18 mm |
memory density | 262144 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP28,.5 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3/3.3 V |
Certification status | Not Qualified |
Maximum seat height | 3 mm |
Maximum standby current | 0.000002 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.027 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 8.4 mm |
HM62V256LFP-8ULT | HM62V256LFP-7SLT | HM62V256LTM-10 | HM62V256LT-10 | |
---|---|---|---|---|
Description | Standard SRAM, 32KX8, 85ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 0.450 INCH, PLASTIC, SOP-28 | Standard SRAM, 32KX8, 100ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP-28 | Standard SRAM, 32KX8, 100ns, CMOS, PDSO32, 8 X 14 MM, TSOP-32 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
Parts packaging code | SOIC | SOIC | TSOP | TSOP |
package instruction | SOP, SOP28,.5 | SOP, SOP28,.5 | TSOP1, TSSOP28,.53,22 | TSOP1, TSSOP32,.56,20 |
Contacts | 28 | 28 | 28 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 85 ns | 70 ns | 100 ns | 100 ns |
I/O type | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G32 |
JESD-609 code | e0 | e0 | e0 | e0 |
length | 18 mm | 18 mm | 11.8 mm | 12.4 mm |
memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 32 |
word count | 32768 words | 32768 words | 32768 words | 32768 words |
character code | 32000 | 32000 | 32000 | 32000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | SOP | TSOP1 | TSOP1 |
Encapsulate equivalent code | SOP28,.5 | SOP28,.5 | TSSOP28,.53,22 | TSSOP32,.56,20 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3 mm | 3 mm | 1.2 mm | 1.2 mm |
Maximum standby current | 0.000002 A | 0.000007 A | 0.000027 A | 0.000027 A |
Minimum standby current | 2 V | 2 V | 2 V | 2 V |
Maximum slew rate | 0.027 mA | 0.03 mA | 0.024 mA | 0.024 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 1.27 mm | 0.55 mm | 0.5 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 8.4 mm | 8.4 mm | 8 mm | 8 mm |