Flash, 64KX16, 200ns, PQCC44, PLASTIC, LCC-44
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Atmel (Microchip) |
Parts packaging code | LCC |
package instruction | QCCJ, |
Contacts | 44 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 200 ns |
Other features | AUTOMATIC WRITE |
JESD-30 code | S-PQCC-J44 |
JESD-609 code | e0 |
length | 16.5862 mm |
memory density | 1048576 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 2 |
Number of functions | 1 |
Number of terminals | 44 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 64KX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 4.57 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
type | NOR TYPE |
width | 16.5862 mm |