DS1653 datasheet, PDF - EEWORLD Datasheet

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DS1653: DescriptionMemory Circuit, 64X1, CMOS, PDIP16, 0.300 INCH, DIP-16; Categorystorage storage; File Size570KB，10 Pages; ManufacturerDALLAS; Websitehttp://www.dalsemi.com

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DS1653 Overview

Memory Circuit, 64X1, CMOS, PDIP16, 0.300 INCH, DIP-16

DS1653 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	DALLAS
package instruction	0.300 INCH, DIP-16
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
memory density	64 bit
Memory IC Type	MEMORY CIRCUIT
memory width	1
Number of functions	1
Number of terminals	16
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	64X1
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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DS1653 Related Products

	DS1653	DS1652	DS1653S
Description	Memory Circuit, 64X1, CMOS, PDIP16, 0.300 INCH, DIP-16	Memory Circuit, 64X1, CMOS, PDIP8, 0.300 INCH, DIP-8	Memory Circuit, 64X1, CMOS, PDSO16, 0.208 INCH, SOIC-16
Is it Rohs certified?	incompatible	incompatible	incompatible
package instruction	0.300 INCH, DIP-16	0.300 INCH, DIP-8	0.208 INCH, SOIC-16
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-PDIP-T16	R-PDIP-T8	R-PDSO-G16
JESD-609 code	e0	e0	e0
memory density	64 bit	64 bit	64 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	1	1	1
Number of functions	1	1	1
Number of terminals	16	8	16
word count	64 words	64 words	64 words
character code	64	64	64
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C
organize	64X1	64X1	64X1
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP
Encapsulate equivalent code	DIP16,.3	DIP8,.3	SOP16,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	NO	YES
technology	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maker	DALLAS	-	DALLAS

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