Product Guide
HD_1105W Series, Dome Lens Type InGaN/SiC SMT LED
s
Features
• High brightness (InGaN/SiC) die material
• Available in green (525nm), bluish-green (505nm)
•
and blue (470nm) colors
• Reflow and dip soldering compatible
• Available for both standard and reverse mounting
• 1000V minimum ESD protection
s
Applications
• Automotive indicator display
• Various other backlight uses
s
Outline Dimensions
s
Recommended Solder Pad
on a Surface Mount
1.55
0.6
1.6
0.3
Anode
s
Recommended Solder Pad
on a reverse mount
1.6
1.5
HOLE
(1.6)
0.5
0.5
R0.8
0.6
Cathode Mark
Polarity Mark
Cathode
PCB
2.3+0.05
Unit: mm
Tolerance + 0.1
s
Electro-Optical Characteristics
Part No.
Material Emitted Lens
Color Color
InGaN/SiC
Green
(Ta=25°C)
Wavelength
Peak
λ
p
TYP.
Spectral Line
Dominant Half Width
λ
d
λ
∆λ
TYP.
TYP.
I
F
Luminous
Intensity
IV
MIN.
TYP.
I
F
Forward
Voltage
V
TYP.
MAX.
F
Reverse Viewing
Current
IR
Angle
I
F
MAX.
V
R
(2
θ
1/2)
HDG1105W
HDC1105W
HDB1105W
70 140 10
Water
70 140 10
Clear
35 70 10
mcd
mA
522
502
467
525
505
470
nm
30
30
26
10
10
10
mA
3.3
3.3
3.3
V
3.8
3.8
3.8
10
10
10
mA
100
100
100
µA
5
5
5
V
Deg.
40°
InGaN/SiC
Bluish-Green
InGaN/SiC
Blue
Units
1.5
2.1 + 0.05
(4.6)
3.2
1.6
(2)
s
Absolute Maximum Ratings
Item
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Green
Bluish-Green
HDC
76
20
48
5
-40 to +85
-40 to +100
0.28 (DC) 0.69 (Pulse)
Blue
HDB
76
20
48
5
(Ta=25°C)
Units
mW
mA
mA
V
°C
°C
mA/°C
Symbol
Pd
I
F
I
FM
V
R
Topr
Tstg
∆I
F
HDG
76
20
48
5
* Ta=25°C,
I
FM
applies for the pulse width
≤
1msec. and duty cycle
≤1/20.
s
Taping Specifications
1.75 + 0.1
4+0.1
φ
1.5
+0.1
0
(1.8)
(0.25)
for Reverse
Mount Type
s
Taping Specifications
φ
1.5
+0.1
0
(1.85)
1.75 +0.1
4+0.1
(0.25)
Center
Hole
8+0.2
for Standard
Mount Type
Quantity on tape:
2000 pieces
per reel
(0.5)
(2.2)
(
φ
1.1)
2 + 0.05
4+0.1
3.5+0.05
8+0.2
(
φ
1.1)
2+0.05
4+0.1
3.5+0.05
(2.1)
Quantity on tape:
2000 pieces
per reel
2+0.5
φ
21+0.8
Center
Hole
Cathode
Center
Hole
(3.45)
(3.5)
φ
13+0.2
Direction to pull
RR
Cathode
+1
φ
60 -0
φ
13+0.2
9+0.3
11.4+1
+0
φ
180 3
s
Operation Current Derating Chart (DC)
Direction to pull
TR
s
Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
DG, DC, DB,
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
LED Surface Temperature
°C
Operation Heating
240
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
s
Spatial Distribution
150
120
Pre-heating
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGHD1105W-0301
~
0
60 to 120 sec.
5 sec. max
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com