BZG04-43 datasheet, PDF - EEWORLD Datasheet

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BZG04-43: DescriptionSurface Mount TVS Diode; Direction: Unidirectional; V(BR) Typ (V): 48V; PPK Max (W): 300W; Condition: 10×1000us; VRWM Max (V): 47.3V; VBR Min (V): 48.235176V; VBR Max (V): 70.4389554V; IR Max (uA): 0.5uA; VC Max (V): 70.8V; Package: SMA; CategoryDiscrete semiconductor diode; File Size482KB，4 Pages; ManufacturerGalaxy Microelectronics

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BZG04-43 Overview

Surface Mount TVS Diode; Direction: Unidirectional; V(BR) Typ (V): 48V; PPK Max (W): 300W; Condition: 10×1000us; VRWM Max (V): 47.3V; VBR Min (V): 48.235176V; VBR Max (V): 70.4389554V; IR Max (uA): 0.5uA; VC Max (V): 70.8V; Package: SMA

BZG04-43 Parametric

Parameter Name	Attribute value
Maker	Galaxy Microelectronics
Parts packaging code	SMA
Reach Compliance Code	unknown

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Production specification

Transient Voltage Suppressor

Features



BZG04--SERIES

Plastic package has underwriters laboratory

flammability classification 94V-0

Optimized for LAN protection applications

Low profile package with built-in strain relief for

surface mounted applications

Glass passivated junction

Low incremental surge resistance, excellent clamping capability

300W peak pulse power capability with a 10/1000μs wave form,

repetition rate (duty cycle): 0.01%

Very fast response time

High temperature soldering guaranteed: 250°C/10 seconds at terminals

Case: SMA molded plastic

Molding compound, UL flammability classification rating 94V-0

Polarity: Color band denotes cathode end

For bi-directional devices, use suffix C (e.g. BZG04-10C). Electrical characteristics apply in both

directions.

Mechanical Data

Devices for Bidirectional Applications

Maximum Ratings

(@T

= 25°C unless otherwise specified)

Parameter

Non-repetitive peak reverse power dissipation 10/1000s

exponential pulse(see Fig.3); T

=25℃prior tosurge; see also

Fig.1

Typical thermal resistance, junction to ambient

Forward voltage @I

=0.5A; seeFig.2

Operating junction temperature range

Operating storage temperature range

θJA

θJL

100(NOTE1)

150(NOTE2)

1.2

-55---+175

℃/W

℃

RSM

300

Symbol

Value

Units

NOTES:

1. Device mounted on an Al2O3 printed-circuit board, 0.7mm thick; thickness of Cu-layer

≥35m,

see Fig.4.

2.Device mounted on an epoxy-glass printed-circuit board, 1.5mm thick; thickness of Cu-layer

≥40μm

SMA001AA

Rev.B

www.gmicroelec.com

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