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KM68FS2000TI-120

Description
Standard SRAM, 256KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32
Categorystorage    storage   
File Size143KB,9 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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KM68FS2000TI-120 Overview

Standard SRAM, 256KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32

KM68FS2000TI-120 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeTSOP1
package instructionTSSOP,
Contacts32
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time120 ns
JESD-30 codeR-PDSO-G32
length18.4 mm
memory density2097152 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.3 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
width8 mm

KM68FS2000TI-120 Related Products

KM68FS2000TI-120 KM68FV2000T-8000 KM68FS2000T-1200 KM68FR2000TI-300 KM68FV2000TI-800 KM68FV2000T-7000 KM68FV2000TI-700 KM68FS2000T-1500 KM68FS2000TI-150 KM68FR2000T-3000
Description Standard SRAM, 256KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 Standard SRAM, 256KX8, 85ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 Standard SRAM, 256KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 Standard SRAM, 256KX8, 300ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 Standard SRAM, 256KX8, 85ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 Standard SRAM, 256KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 Standard SRAM, 256KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 Standard SRAM, 256KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 Standard SRAM, 256KX8, 150ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 Standard SRAM, 256KX8, 300ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32
Parts packaging code TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1
package instruction TSSOP, TSSOP, TSSOP, TSSOP, TSSOP, TSSOP, TSSOP, TSSOP, TSSOP, TSSOP,
Contacts 32 32 32 32 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 120 ns 85 ns 120 ns 300 ns 85 ns 70 ns 70 ns 150 ns 150 ns 300 ns
JESD-30 code R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
length 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32 32 32
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C 70 °C 85 °C 70 °C
organize 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8 256KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.3 V 3.6 V 3.3 V 2.7 V 3.6 V 3.6 V 3.6 V 3.3 V 3.3 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V 3 V 2.3 V 1.8 V 3 V 3 V 3 V 2.3 V 2.3 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V 3.3 V 2.5 V 2 V 3.3 V 3.3 V 3.3 V 2.5 V 2.5 V 2 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm
Maker SAMSUNG - SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG

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