|
IP80C88 |
IP80C88-2 |
MD80C88/B |
Description |
16-BIT, 5MHz, MICROPROCESSOR, PDIP40, PLASTIC, DIP-40 |
16-BIT, 8MHz, MICROPROCESSOR, PDIP40, PLASTIC, DIP-40 |
16-BIT, 5MHz, MICROPROCESSOR, CDIP40, CERDIP-40 |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
Maker |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Renesas Electronics Corporation |
Parts packaging code |
DIP |
DIP |
DIP |
package instruction |
DIP, DIP40,.6 |
DIP, DIP40,.6 |
DIP, DIP40,.6 |
Contacts |
40 |
40 |
40 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
Address bus width |
20 |
20 |
20 |
bit size |
16 |
16 |
16 |
boundary scan |
NO |
NO |
NO |
maximum clock frequency |
5 MHz |
8 MHz |
5 MHz |
External data bus width |
8 |
8 |
8 |
Format |
FIXED POINT |
FIXED POINT |
FIXED POINT |
Integrated cache |
NO |
NO |
NO |
JESD-30 code |
R-PDIP-T40 |
R-PDIP-T40 |
R-CDIP-T40 |
JESD-609 code |
e0 |
e0 |
e0 |
low power mode |
YES |
YES |
YES |
Number of terminals |
40 |
40 |
40 |
Maximum operating temperature |
85 °C |
85 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-55 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
DIP |
DIP |
DIP |
Encapsulate equivalent code |
DIP40,.6 |
DIP40,.6 |
DIP40,.6 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
IN-LINE |
IN-LINE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT APPLICABLE |
power supply |
5 V |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
6.35 mm |
6.35 mm |
5.72 mm |
speed |
5 MHz |
8 MHz |
5 MHz |
Maximum slew rate |
50.5 mA |
80.5 mA |
50.5 mA |
Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage |
5 V |
5 V |
5 V |
surface mount |
NO |
NO |
NO |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
MILITARY |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT APPLICABLE |
width |
15.24 mm |
15.24 mm |
15.24 mm |
uPs/uCs/peripheral integrated circuit type |
MICROPROCESSOR |
MICROPROCESSOR |
MICROPROCESSOR |
length |
51.75 mm |
51.75 mm |
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