D/A Converter, 1 Func, Parallel, Word Input Loading, 2us Settling Time, CDIP24, DOUBLE WIDTH, CERAMIC, DIP-24
Parameter Name | Attribute value |
Maker | Spectrum Microwave |
Parts packaging code | DIP |
package instruction | DIP, DIP24,.6 |
Contacts | 24 |
Reach Compliance Code | unknown |
Maximum analog output voltage | 10 V |
Minimum analog output voltage | |
Converter type | D/A CONVERTER |
Enter bit code | BINARY, OFFSET BINARY |
Input format | PARALLEL, WORD |
JESD-30 code | R-CDIP-T24 |
Maximum linear error (EL) | 0.002% |
Number of digits | 16 |
Number of functions | 1 |
Number of terminals | 24 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 15 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Nominal settling time (tstl) | 2 µs |
Nominal supply voltage | 15 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
DAC9331-16-5 | DAC9331-16-4 | DAC9331-16-6 | |
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Description | D/A Converter, 1 Func, Parallel, Word Input Loading, 2us Settling Time, CDIP24, DOUBLE WIDTH, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 2us Settling Time, CDIP24, DOUBLE WIDTH, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 2us Settling Time, CDIP24, DOUBLE WIDTH, CERAMIC, DIP-24 |
Maker | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave |
Parts packaging code | DIP | DIP | DIP |
package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
Contacts | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown |
Maximum analog output voltage | 10 V | 10 V | 10 V |
Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
Enter bit code | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
Input format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
JESD-30 code | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 |
Maximum linear error (EL) | 0.002% | 0.003% | 0.001% |
Number of digits | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 24 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | DIP | DIP |
Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE |
power supply | 15 V | 15 V | 15 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm |
Nominal settling time (tstl) | 2 µs | 2 µs | 2 µs |
Nominal supply voltage | 15 V | 15 V | 15 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
width | 15.24 mm | 15.24 mm | 15.24 mm |