HC/UH SERIES, DUAL 6-INPUT AND-OR-INVERT GATE, PDSO14, SOIC-14
Parameter Name | Attribute value |
Maker | Motorola ( NXP ) |
Parts packaging code | SOIC |
package instruction | SOP, |
Contacts | 14 |
Reach Compliance Code | unknown |
Other features | ASYMMETRICAL I/P\'S |
series | HC/UH |
JESD-30 code | R-PDSO-G14 |
length | 8.65 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | AND-OR-INVERT GATE |
Number of functions | 2 |
Number of entries | 6 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
propagation delay (tpd) | 38 ns |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
Maximum supply voltage (Vsup) | 6 V |
Minimum supply voltage (Vsup) | 2 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 3.9 mm |
MC74HC51DDR2 | MC74HC51ND | MC54HC51JD | |
---|---|---|---|
Description | HC/UH SERIES, DUAL 6-INPUT AND-OR-INVERT GATE, PDSO14, SOIC-14 | HC/UH SERIES, DUAL 6-INPUT AND-OR-INVERT GATE, PDIP14, PLASTIC, DIP-14 | AND-OR-Invert Gate, HC/UH Series, 2-Func, 6-Input, CMOS, CDIP14, CERAMIC, DIP-14 |
Maker | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
package instruction | SOP, | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | unknown | unknown | unknown |
Other features | ASYMMETRICAL I/P\'S | ASYMMETRICAL I/P\'S | ASYMMETRICAL I/P\'S |
series | HC/UH | HC/UH | HC/UH |
JESD-30 code | R-PDSO-G14 | R-PDIP-T14 | R-GDIP-T14 |
length | 8.65 mm | 18.86 mm | 19.495 mm |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE |
Number of functions | 2 | 2 | 2 |
Number of entries | 6 | 6 | 6 |
Number of terminals | 14 | 14 | 14 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
encapsulated code | SOP | DIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | IN-LINE |
propagation delay (tpd) | 38 ns | 38 ns | 38 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.75 mm | 4.69 mm | 5.08 mm |
Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V |
Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | YES | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY |
Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
width | 3.9 mm | 7.62 mm | 7.62 mm |
Parts packaging code | SOIC | DIP | - |
Contacts | 14 | 14 | - |
Is it Rohs certified? | - | incompatible | incompatible |
JESD-609 code | - | e0 | e0 |
Encapsulate equivalent code | - | DIP14,.3 | DIP14,.3 |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED |
power supply | - | 2/6 V | 2/6 V |
Schmitt trigger | - | NO | NO |
Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED |