32-BIT, 100MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Rochester Electronics |
Parts packaging code | BGA |
package instruction | PLASTIC, BGA-256 |
Contacts | 256 |
Reach Compliance Code | unknown |
Other features | ALSO REQUIRES 3.3V SUPPLY |
Address bus width | 32 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 66 MHz |
External data bus width | 32 |
Format | FIXED POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e1 |
length | 23 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of terminals | 256 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 245 |
Certification status | COMMERCIAL |
Maximum seat height | 2.54 mm |
speed | 100 MHz |
Maximum supply voltage | 1.9 V |
Minimum supply voltage | 1.7 V |
Nominal supply voltage | 1.8 V |
surface mount | YES |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 23 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
MPC852TVR100A | MPC852TCVR50A | MPC852TVR66A | MPC852TVR80A | |
---|---|---|---|---|
Description | 32-BIT, 100MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | 32-BIT, 80MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 |
Is it lead-free? | Lead free | Contains lead | Lead free | Lead free |
Is it Rohs certified? | conform to | conform to | conform to | conform to |
Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
Parts packaging code | BGA | BGA | BGA | BGA |
package instruction | PLASTIC, BGA-256 | PLASTIC, BGA-256 | PLASTIC, BGA-256 | PLASTIC, BGA-256 |
Contacts | 256 | 256 | 256 | 256 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Other features | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
Address bus width | 32 | 32 | 32 | 32 |
bit size | 32 | 32 | 32 | 32 |
boundary scan | YES | YES | YES | YES |
maximum clock frequency | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
External data bus width | 32 | 32 | 32 | 32 |
Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
Integrated cache | YES | YES | YES | YES |
JESD-30 code | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 |
JESD-609 code | e1 | e1 | e1 | e1 |
length | 23 mm | 23 mm | 23 mm | 23 mm |
low power mode | YES | YES | YES | YES |
Humidity sensitivity level | 3 | 3 | 3 | 3 |
Number of terminals | 256 | 256 | 256 | 256 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA | BGA | BGA |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 245 | 245 | 245 | 245 |
Certification status | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Maximum seat height | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
speed | 100 MHz | 50 MHz | 66 MHz | 80 MHz |
Maximum supply voltage | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
Minimum supply voltage | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
Nominal supply voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
surface mount | YES | YES | YES | YES |
Terminal surface | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |
Terminal form | BALL | BALL | BALL | BALL |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 |
width | 23 mm | 23 mm | 23 mm | 23 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |