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MPC8275VRMHB

Description
Micro Peripheral IC, CMOS, PBGA516,
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,68 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MPC8275VRMHB Overview

Micro Peripheral IC, CMOS, PBGA516,

MPC8275VRMHB Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
package instructionBGA, BGA516,26X26,40
Reach Compliance Codeunknown
JESD-30 codeS-PBGA-B516
Number of terminals516
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA516,26X26,40
Package shapeSQUARE
Package formGRID ARRAY
power supply1.5,3.3 V
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Advance Information
MPC8280EC/D
Rev. 0.2, 11/2002
MPC8280
Hardware Specifications
This document contains detailed information on power considerations, DC/AC electrical
characteristics, and AC timing specifications for .13µm (HiP7) members of the
PowerQUICC II™ family of integrated communications processors—the MPC8280 and the
MPC8270 (collectively referred to throughout this document as the MPC8280).
The following topics are addressed:
Topic
Section 1.1, “Features”
Section 1.2, “Electrical and Thermal Characteristics”
Section 1.2.1, “DC Electrical Characteristics”
Section 1.2.2, “Thermal Characteristics”
Section 1.2.3, “AC Electrical Characteristics”
Section 1.3, “Clock Configuration Modes”
Section 1.3.1, “Local Bus Mode”
Section 1.3.2, “PCI Mode”
Section 1.4, “Pinout”
Section 1.5, “Package Description”
Section 1.6, “Ordering Information”
Page
2
6
6
10
11
18
18
21
35
63
66
HiP7 members of the PowerQUICC II™ family are available in two packages—the standard
ZU package and an alternate VR package—as shown in Table 1. For more information on VR
packages, contact your Motorola sales office. Note that throughout this document references
to the MPC8280 are inclusive of VR-package devices unless otherwise specified.
Table 1. HiP7 PowerQUICC II Device Packages
ZU
(480 TBGA)
MPC8280
MPC8270
VR
(516 PBGA)
MPC8275VR
MPC8270VR
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

MPC8275VRMHB Related Products

MPC8275VRMHB MPC8270VRMHB
Description Micro Peripheral IC, CMOS, PBGA516, Micro Peripheral IC, CMOS, PBGA516
Maker Motorola ( NXP ) Motorola ( NXP )
package instruction BGA, BGA516,26X26,40 BGA, BGA516,26X26,40
Reach Compliance Code unknown unknown
JESD-30 code S-PBGA-B516 S-PBGA-B516
Number of terminals 516 516
Maximum operating temperature 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Encapsulate equivalent code BGA516,26X26,40 BGA516,26X26,40
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
power supply 1.5,3.3 V 1.5,3.3 V
Certification status Not Qualified Not Qualified
surface mount YES YES
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM

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