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DS3100GN#

Description
Support Circuit, 1-Func, PBGA256, 17 X 17 MM, CSBGA-256
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,211 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Download Datasheet Parametric Compare View All

DS3100GN# Overview

Support Circuit, 1-Func, PBGA256, 17 X 17 MM, CSBGA-256

DS3100GN# Parametric

Parameter NameAttribute value
MakerMaxim
Parts packaging codeBGA
package instructionBGA,
Contacts256
Reach Compliance Codeunknown
JESD-30 codeS-PBGA-B256
length17 mm
Number of functions1
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height1.77 mm
Nominal supply voltage1.8 V
surface mountYES
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width17 mm
+
PRELIMINARY DATASHEET
DS3100
Stratum 3/3E Timing Card IC
www.maxim-ic.com
GENERAL DESCRIPTION
When paired with an external TCXO or OCXO, the
DS3100 is a complete central timing and
synchronization solution for SONET/SDH network
elements. With two multi-protocol BITS/SSU
receivers and fourteen input clocks, the device
directly accepts both external timing and line timing
from a large number of line cards. All input clocks are
continuously monitored for frequency accuracy and
activity. Any two of the input clocks can be selected
as the references for the two core DPLLs. The T0
DPLL complies with the stratum 3 and 3E
requirements of GR1244, GR-253, and the
requirements of G.812 Type III and G.813. From the
output of the core DPLLs a wide variety of output
clock frequencies and frame pulses can be produced
simultaneously on the eleven output clock pins. Two
DS3100 devices can be configured in a master/slave
arrangement for timing card equipment protection.
The DS3100 registers and I/O pins are backward
compatible with Semtech’s ACS8520 and ACS8530
timing card ICs.
FEATURES
Synchronization subsystem for stratum 3E, 3, 4E
and 4, SMC and SEC
- Meets requirements of GR-1244 stratum 3/3E,
GR-253, G.812 Types I and III, and G.813
- Stratum 3E holdover accuracy with suitable
external oscillator
- Programmable bandwidth, 0.5 mHz to 70 Hz
- Hitless reference switching on loss of input
- Phase build-out and transient absorption
- Locks to and generates 125 MHz for timing
over Gigabit Ethernet per ITU-T G.pactiming
Fourteen Input Clocks
- Ten CMOS/TTL inputs accept 2kHz, 4kHz and
any multiple of 8 kHz up to 125 MHz
- Two LVDS/LVPECL/CMOS/TTL inputs accept
Nx8 kHz up to 125 MHz plus 155.52 MHz
- Two 64 kHz Composite Clock receivers
- Continuous input clock quality monitoring
- Separate 2/4/8 kHz frame sync input
Eleven Output Clocks
- Five CMOS/TTL outputs drive any internally
produced clock up to 77.76 MHz
- Two LVDS outputs each drive any internally
produced clock up to 311.04 MHz
- One 64 kHz Composite Clock transmitter
- One 1.544 MHz / 2.048 MHz output clock
- Two sync pulses: 8 kHz and 2 kHz
- Output clock rates include 2 kHz, 8 kHz, NxDS1,
NxDS2, DS3, NxE1, E3, 6.48 MHz, 19.44 MHz,
38.88 MHz, 51.84 MHz, 62.5 MHz, 77.76 MHz,
125 MHz, 155.52 MHz, 311.04 MHz
Two multi-protocol BITS/SSU transceivers
- Receive and transmit DS1, E1, 2048 kHz, and
6312 kHz timing signals
- Insert and extract SSM messages (DS1, E1)
- Automatically invalidate clocks on LOS, OOF,
AIS and other defects
Internal compensation for master clock oscillator
frequency accuracy
Processor interface: 8-bit parallel or SPI serial
1.8V operation with 3.3V I/O (5V tolerant)
Industrial operating temperature range
APPLICATIONS
SONET/SDH ADMs, MSPPs, and MSSPs
Digital Cross-Connects
DSLAMs
Service Provider Routers
FUNCTIONAL DIAGRAM
timing from
line cards
(various rates)
timing from
BITS/SSU
(DS1, E1, CC, etc.)
local TCXO
or OCXO
14
2
DS3100
SONET/SDH
Synchronization
IC
2
timing to
BITS/SSU
(DS1, E1, CC, etc.)
timing to
line cards
(various rates)
11
control status
ORDERING INFORMATION
PART
DS3100GN#
DS3100GN+
TEMP
-40 to 85°C
-40 to 85°C
PACKAGE
17x17 mm CSBGA,
tin/lead
17x17 mm CSBGA,
lead free
REV: 052406
1 of 211

DS3100GN# Related Products

DS3100GN#
Description Support Circuit, 1-Func, PBGA256, 17 X 17 MM, CSBGA-256
Maker Maxim
Parts packaging code BGA
package instruction BGA,
Contacts 256
Reach Compliance Code unknown
JESD-30 code S-PBGA-B256
length 17 mm
Number of functions 1
Number of terminals 256
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material PLASTIC/EPOXY
encapsulated code BGA
Package shape SQUARE
Package form GRID ARRAY
Certification status Not Qualified
Maximum seat height 1.77 mm
Nominal supply voltage 1.8 V
surface mount YES
Telecom integrated circuit types ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level INDUSTRIAL
Terminal form BALL
Terminal pitch 1 mm
Terminal location BOTTOM
width 17 mm
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