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CY7C1006L-15PC

Description
Standard SRAM, 256KX4, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Categorystorage    storage   
File Size195KB,9 Pages
ManufacturerCypress Semiconductor
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CY7C1006L-15PC Overview

Standard SRAM, 256KX4, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

CY7C1006L-15PC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCypress Semiconductor
Parts packaging codeDIP
package instructionDIP,
Contacts28
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time15 ns
Other featuresAUTOMATIC POWER-DOWN
JESD-30 codeR-PDIP-T28
JESD-609 codee0
length35.4965 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width4
Number of functions1
Number of ports1
Number of terminals28
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX4
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height4.826 mm
Minimum standby current2 V
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

CY7C1006L-15PC Related Products

CY7C1006L-15PC CY7C1006L-15DMB CY7C1006L-12PC CY7C1006L-20PC CY7C1006L-20DMB CY7C1006L-25DMB CY7C1006L-25PC
Description Standard SRAM, 256KX4, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Standard SRAM, 256KX4, 15ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 Standard SRAM, 256KX4, 12ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Standard SRAM, 256KX4, 20ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Standard SRAM, 256KX4, 20ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 Standard SRAM, 256KX4, 25ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28 Standard SRAM, 256KX4, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor
Parts packaging code DIP DIP DIP DIP DIP DIP DIP
package instruction DIP, DIP, DIP, DIP, DIP, DIP, DIP,
Contacts 28 28 28 28 28 28 28
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN code 3A991.B.2.B 3A001.A.2.C 3A991.B.2.B 3A991.B.2.B 3A001.A.2.C 3A001.A.2.C EAR99
Maximum access time 15 ns 15 ns 12 ns 20 ns 20 ns 25 ns 25 ns
Other features AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN AUTOMATIC POWER-DOWN
JESD-30 code R-PDIP-T28 R-GDIP-T28 R-PDIP-T28 R-PDIP-T28 R-GDIP-T28 R-GDIP-T28 R-PDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0
length 35.4965 mm 37.0205 mm 35.4965 mm 35.4965 mm 37.0205 mm 37.0205 mm 35.4965 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 4 4 4 4 4 4 4
Number of functions 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28 28
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 125 °C 70 °C 70 °C 125 °C 125 °C 70 °C
organize 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES YES YES YES
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.826 mm 5.08 mm 4.826 mm 4.826 mm 5.08 mm 5.08 mm 4.826 mm
Minimum standby current 2 V 2 V 2 V 2 V 2 V 2 V 2 V
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL MILITARY COMMERCIAL COMMERCIAL MILITARY MILITARY COMMERCIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm
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