WIREWOUND CHIP INDUCTORS
1. PART NO. EXPRESSION :
SCI0603HC SERIES
SCI0603HC-1N6JF
(a)
(b)
(c)
(d) (e)(f)
(a) Series code
(b) Dimension code
(c) Type code : HC ( High Current )
(d) Inductance code : 1N6 = 1.6nH
(e) Tolerance code : J = ±5%, K = ±10%, M = ±20%
(f) F : Lead Free
2. CONFIGURATION & DIMENSIONS :
B
E
C
D
I
G
I
A
G
F
F
PCB Pattern
Unit:m/m
A
1.80 Max.
B
C
D
0.38 Ref.
E
0.76 Ref.
F
0.33 Ref.
G
0.86 Ref.
H
1.02 Ref.
I
0.64 Ref.
J
0.64 Ref.
1.12 Max. 1.02 Max.
3. SCHEMATIC :
4. MATERIALS :
a
(a) Core : Ceramic U core
(b) Wire : Enamelled Copper Wire
b
(c) Terminal Metallization : Ag + Ni + Au
c
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
04.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
WIREWOUND CHIP INDUCTORS
5. GENERAL SPECIFICATION :
a) Storage temp. : -25°C to +80°C
b) Operating temp. : -40°C to +125°C
c) Temperature rise : 40°C Max.
d) Rated current : Base on temp. rise & L/L0A=10% Max.
e) Resistance to solder heat : 260°C.10sec
SCI0603HC SERIES
6. ELECTRICAL CHARACTERISTICS :
Part No.
SCI0603HC-1N6 F
SCI0603HC-3N6 F
SCI0603HC-3N9 F
SCI0603HC-6N8 F
SCI0603HC-7N5 F
SCI0603HC-10N F
SCI0603HC-12N F
SCI0603HC-15N F
SCI0603HC-18N F
SCI0603HC-22N F
SCI0603HC-24N F
Inductance tolerance :
: G : ±2%
J : ±5%
K : ±10%
Tolerance
Available
K, J
K, J
K, J
K, J
K, J
K, J, G
K, J, G
K, J, G
K, J, G
K, J, G
K, J, G
L
( nH )
1.6
3.6
3.9
6.8
7.5
10
12
15
18
22
24
Test
Freq
( MHz )
250
250
250
250
250
250
250
250
250
250
250
Q
Min.
24
24
25
35
35
38
38
38
40
42
42
Q Test
Freq
( MHz )
250
250
250
250
250
250
250
250
250
250
250
SRF
( MHz )
Min.
12500
5900
5900
5800
3700
3700
3000
2800
2800
2400
2400
DCR
( )
Max.
0.030
0.048
0.054
0.054
0.059
0.071
0.075
0.080
0.099
0.099
0.105
IDC
(mA)
Max.
2400
2300
2200
2100
2100
2000
2000
1900
1900
1800
1800
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
WIREWOUND CHIP INDUCTORS
7. ELECTRICAL CHARACTERISTICS :
CONFIGURATTION :
SCI0603HC SERIES
COVER TAPE
EMBOSSED CARRIER
F±0.1
4±0.1
G±0.05
Ø1.5
I±0.05
A±0.2
E±0.05
D±0.1
C±0.1
B±0.1
Ø1.5
H±0.05
DIMENSION (unit: mm)
SERIES
SCI0402
SCI0603
SCI0805
SCI1008
A
8.0
8.0
8.0
8.0
B
0.71
1.10
1.88
2.73
C
2.0
4.0
4.0
4.0
D
1.16
1.75
2.38
2.88
E
3.5
3.5
3.5
3.5
F
1.75
1.75
1.75
1.75
G
0
2
2
2
H
0.65
1.15
1.48
2.33
I
0.23
0.25
0.20
0.20
PACKING QUANTITY
INNER REEL
SERIES
Q'TY (PCS)
4000
4000
2000
2000
SCI0402
SCI0603
SCI0805
SCI1008
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
WIREWOUND CHIP INDUCTORS
8. ENVIRONMENTAL CHARACTERISTICS :
Electrical Performance Test :
SCI0603HC SERIES
ITEM
1
Inductance
SPECIFICATION
TEST CONDITIONS / TEST METHODS
HP4291B
2
Q
Refer to Electrcal
Characteristics List
HP4291B
3
SRF
HP8753D
4
DC Resistance Rdc
Mico-Ohmmeter (GOM-801G)
5
Rated Current IDC
The device should be REFLOW soldered (230±5°C for
10 seconds) to a tinned copper subs rate. A dynamiter
6
Over Load Test
After test, inductors shall
have no evidence of
electrical and mechanical
damage
Applied 2 times of rated allowed DC current to inductor
for a period of 5 minute.
7
Withstanding
Voltage Test
After test, inductors shall
have no evidence of
electrical and mechanical
damage
AC voltage of 500VAC applied between inductors
terminal and case for 1 minute.
8
Insulation
Resistance Test
1000 MOhm min.
100VDC applied between inductor terminal and case
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
WIREWOUND CHIP INDUCTORS
SCI0603HC SERIES
Mechanical Performance Test :
ITEM
1
Vibration
SPECIFICATION
Appearance : No damage
L change : within ±5%
Q change : within ±10%
TEST CONDITIONS / TEST METHODS
Test device shall be soldered on the substrate
Oscillation Frequency : 10 to 55 to 10Hz for 1 min.
Amplitude : 1.5mm
Time : 2hrs for each axis (X, Y, Z), total 6hrs.
2
Resistance to
Soldering Heat
Appearance : No damage
L change : within ±5%
Q change : within ±10%
Pre-heating : 150°C, 1 min
Solder Composition : Sn/Pb=63/67
Solder Temperature : 230±5°C
Immersion Time : 20±2sec
Solder Temperature : 260±5°C
Immersion Time : 5±2sec
3
Component
Adhesion
(Push Test)
1 lbs. For 0402
2 lbs. For 0603
3 lbs. For the rest
The device should be REFLOW soldered (230±5°C for
10 seconds) to a tinned copper subs rate. A dynamiter
force gauge should be applied to the side of the
conponent. The device must withstand a minimum force
of 2 or 4 pounds without a failure of the termination
attached to component.
3
Component
Adhesion
(Push Test)
The electrodes shall be at
least 90% covered with new
solder coating.
Pre-heating : 150°C, 1min
Solder Composition : Sn/Pb=63/67
Solder Temperature : 230±5°C
Immersion Time : 4±1sec
4
Drop Test
After test, the chip inductor
don't fell of broke on the
P.C.Board
Drop 1 time for each face and 1 time for each corner.
Total drop 10 times.
Drop Height : 100cm
Drop Weight : 125g
5
Solderability Test
The terminal should at least
be 90% covered with solder
after fluxing (alpha 100 or equiv), inductor shall be
dipped in a melted solder bath at 232±5°C for 5 seconds.
6
Resistance to
solvent test
There shall be no case of
deformation change in
appearance of obliteration
of marking
MIL-STD202F, METHOD 215D
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
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