NAND Gate, ACT Series, 3-Func, 3-Input, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16
Parameter Name | Attribute value |
Maker | Rochester Electronics |
package instruction | DIP, |
Reach Compliance Code | unknown |
Other features | CENTER PIN VCC AND GND |
series | ACT |
JESD-30 code | R-PDIP-T16 |
length | 19.305 mm |
Logic integrated circuit type | NAND GATE |
Number of functions | 3 |
Number of entries | 3 |
Number of terminals | 16 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
propagation delay (tpd) | 8.2 ns |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
Base Number Matches | 1 |
74ACT11010N | 74ACT11010DR | 74ACT11010D | |
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Description | NAND Gate, ACT Series, 3-Func, 3-Input, CMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 | NAND Gate, ACT Series, 3-Func, 3-Input, CMOS, PDSO16, PLASTIC, SO-16 | NAND Gate, ACT Series, 3-Func, 3-Input, CMOS, PDSO16, PLASTIC, SO-16 |
Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics |
package instruction | DIP, | SOP, | SOP, |
Reach Compliance Code | unknown | unknown | unknown |
Other features | CENTER PIN VCC AND GND | CENTER PIN VCC AND GND | CENTER PIN VCC AND GND |
series | ACT | ACT | ACT |
JESD-30 code | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
length | 19.305 mm | 9.9 mm | 9.9 mm |
Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE |
Number of functions | 3 | 3 | 3 |
Number of entries | 3 | 3 | 3 |
Number of terminals | 16 | 16 | 16 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
propagation delay (tpd) | 8.2 ns | 8.2 ns | 8.2 ns |
Maximum seat height | 5.08 mm | 1.75 mm | 1.75 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL |
width | 7.62 mm | 3.9 mm | 3.9 mm |
Base Number Matches | 1 | 1 | 1 |