MASK ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | AMD |
Parts packaging code | QFJ |
package instruction | QCCJ, LDCC32,.5X.6 |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 150 ns |
JESD-30 code | R-PQCC-J32 |
JESD-609 code | e0 |
length | 13.97 mm |
memory density | 1048576 bit |
Memory IC Type | MASK ROM |
memory width | 8 |
Humidity sensitivity level | 2 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC32,.5X.6 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 220 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.556 mm |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 11.43 mm |
Base Number Matches | 1 |