IDT71V2559SA80BQI datasheet, PDF

IDT71V2559SA80BQI: DescriptionZBT SRAM, 256KX18, 8ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165; Categorystorage storage; File Size510KB，28 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT71V2559SA80BQI Overview

ZBT SRAM, 256KX18, 8ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	BGA
package instruction	13 X 15 MM, FBGA-165
Contacts	165
Reach Compliance Code	not_compliant
ECCN code	3A991.B.2.A
Maximum access time	8 ns
Other features	FLOW-THROUGH ARCHITECTURE
Maximum clock frequency (fCLK)	95 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B165
JESD-609 code	e0
length	15 mm
memory density	4718592 bit
Memory IC Type	ZBT SRAM
memory width	18
Humidity sensitivity level	3
Number of functions	1
Number of terminals	165
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA165,11X15,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	2.5,3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.045 A
Minimum standby current	3.14 V
Maximum slew rate	0.26 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn63Pb37)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	13 mm
Base Number Matches	1

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