Telecom Circuit, 1-Func, LOW PROFILE, HERMETIC SEALED, MODULE-8
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | Broadcom |
| package instruction | LOW PROFILE, HERMETIC SEALED, MODULE-8 |
| Reach Compliance Code | compliant |
| JESD-30 code | R-XDFO-T8 |
| JESD-609 code | e0 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | FIBER OPTIC |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| surface mount | NO |
| Telecom integrated circuit types | TELECOM CIRCUIT |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
