R5F21104DFP datasheet, PDF - EEWORLD Datasheet

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R5F21104DFP: DescriptionRENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，199 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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R5F21104DFP Overview

RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER

R5F21104DFP Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Renesas Electronics Corporation
Parts packaging code	QFP
package instruction	LQFP, QFP32,.35SQ,32
Contacts	32
Reach Compliance Code	unknow
Has ADC	YES
Other features	IT ALSO OPERATES 2.7V AT 10MHZ
Address bus width
bit size	16
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQFP-G32
length	7 mm
Humidity sensitivity level	3
Number of I/O lines	24
Number of terminals	32
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP32,.35SQ,32
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	3/5 V
Certification status	Not Qualified
RAM (bytes)	1024
rom(word)	16384
ROM programmability	FLASH
Maximum seat height	1.7 mm
speed	16 MHz
Maximum slew rate	14 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	3 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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REJ09B0019-0120

R8C/10 Group

Hardware Manual

RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER

M16C FAMILY / R8C /Tiny SERIES

All information contained in these materials, including products and product specifications,

represents information on the product at the time of publication and is subject to change by

Renesas Technology Corp. without notice. Please review the latest information published

by Renesas Technology Corp. through various means, including the Renesas Technology

Corp. website (http://www.renesas.com).

Rev. 1.20

Revision date: Jan 27, 2006

www.renesas.com

Keep safety first in your circuit designs!

Renesas Technology Corp. puts the maximum effort into making semiconductor products

better and more reliable, but there is always the possibility that trouble may occur with

them. Trouble with semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with ap-

propriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-

flammable material or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

These materials are intended as a reference to assist our customers in the selection of the

Renesas Technology Corp. product best suited to the customer's application; they do not

convey any license under any intellectual property rights, or any other rights, belonging to

Renesas Technology Corp. or a third party.

Renesas Technology Corp. assumes no responsibility for any damage, or infringement of

any third-party's rights, originating in the use of any product data, diagrams, charts, pro-

grams, algorithms, or circuit application examples contained in these materials.

All information contained in these materials, including product data, diagrams, charts, pro-

grams and algorithms represents information on products at the time of publication of these

materials, and are subject to change by Renesas Technology Corp. without notice due to

product improvements or other reasons. It is therefore recommended that customers con-

tact Renesas Technology Corp. or an authorized Renesas Technology Corp. product dis-

tributor for the latest product information before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other

loss rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by vari-

ous means, including the Renesas Technology Corp. Semiconductor home page (http://

www.renesas.com).

When using any or all of the information contained in these materials, including product

data, diagrams, charts, programs, and algorithms, please be sure to evaluate all informa-

tion as a total system before making a final decision on the applicability of the information

and products. Renesas Technology Corp. assumes no responsibility for any damage, liabil-

ity or other loss resulting from the information contained herein.

Renesas Technology Corp. semiconductors are not designed or manufactured for use in a

device or system that is used under circumstances in which human life is potentially at

stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology

Corp. product distributor when considering the use of a product contained herein for any

specific purposes, such as apparatus or systems for transportation, vehicular, medical,

aerospace, nuclear, or undersea repeater use.

The prior written approval of Renesas Technology Corp. is necessary to reprint or repro-

duce in whole or in part these materials.

If these products or technologies are subject to the Japanese export control restrictions,

they must be exported under a license from the Japanese government and cannot be im-

ported into a country other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/

or the country of destination is prohibited.

Please contact Renesas Technology Corp. for further details on these materials or the

products contained therein.

Table of Contents

SFR Page Reference

Chapter 1. Overview ............................................................. 1

1.1

1.2

1.3

1.4

1.5

1.6

Applications ................................................................................................................... 1

Performance Overview .................................................................................................. 2

Block Diagram ............................................................................................................... 3

Product Information ...................................................................................................... 4

Pin Assignments ............................................................................................................ 5

Pin Description .............................................................................................................. 6

Chapter 2. Central Processing Unit (CPU) ......................... 7

2.1 Data Registers (R0, R1, R2 and R3 ) ............................................................................. 7

2.2 AddressRegisters (A0 and A1) ...................................................................................... 8

2.3 Frame Base Register( FB ) ............................................................................................. 8

2.4 Interrupt Table Register (INTB )..................................................................................... 8

2.5 Program Counter (PC ) ................................................................................................... 8

2.6 User Stack Pointer (USP ) and Interrupt Stack Pointer (ISP )..................................... 8

2.7 Static Base Register (SB ) ............................................................................................. 8

2.8 Flag Register (FLG ) ....................................................................................................... 8

2.8.1 Carry Flag ( C Flag ) ................................................................................................................................ 8

2.8.2 Debug Flag ( D Flag ) .............................................................................................................................. 8

2.8.3 Zero Flag ( Z Flag ) .................................................................................................................................. 8

2.8.4 Sign Flag ( S Flag ) .................................................................................................................................. 8

2.8.5 Register Bank Select Flag ( B Flag ) ..................................................................................................... 8

2.8.6 Overflow Flag ( O Flag) ........................................................................................................................... 8

2.8.7 Interrupt Enable Flag ( I Flag ) ............................................................................................................... 8

2.8.8 Stack Pointer Select Flag ( U Flag ) ....................................................................................................... 8

2.8.9 Processor Interrupt Priority Level ( IPL ) .............................................................................................. 8

2.8.10 Reserved Area ....................................................................................................................................... 8

Chapter 3. Memory ............................................................... 9

Chapter 4. Special Function Registers (SFR) .................. 10

Chapter 5. Reset .................................................................. 14

5.1 Hardware Reset ............................................................................................................ 14

5.2 Software Reset .............................................................................................................. 14

5.3 Watchdog Timer Reset ................................................................................................. 14

Chapter 6. Clock Generation Circuit.................................. 17

6.1 Main Clock ..................................................................................................................... 21

6.2 On-Chip Oscillator Clock ............................................................................................. 22

A-1

R5F21104DFP Related Products

	R5F21104DFP	R8C/10	R8C10	M16CFAMILY	R5F21102FP	R5F21103FP	R5F21102DFP
Description	RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER	RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER	RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER	RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER	RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER	RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER	RENESAS 16-BIT SINGLE-CHIP MICROCOMPUTER
Is it lead-free?	Lead free	-	-	-	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	-	-	-	conform to	conform to	conform to
Parts packaging code	QFP	-	-	-	QFP	QFP	QFP
package instruction	LQFP, QFP32,.35SQ,32	-	-	-	LQFP, QFP32,.35SQ,32	LQFP, QFP32,.35SQ,32	LQFP, QFP32,.35SQ,32
Contacts	32	-	-	-	32	32	32
Reach Compliance Code	unknow	-	-	-	unknow	unknow	compli
Has ADC	YES	-	-	-	YES	YES	YES
Other features	IT ALSO OPERATES 2.7V AT 10MHZ	-	-	-	IT ALSO OPERATES 2.7V AT 10MHZ	IT ALSO OPERATES 2.7V AT 10MHZ	IT ALSO OPERATES 2.7V AT 10MHZ
bit size	16	-	-	-	16	16	16
maximum clock frequency	16 MHz	-	-	-	16 MHz	16 MHz	16 MHz
DAC channel	NO	-	-	-	NO	NO	NO
DMA channel	NO	-	-	-	NO	NO	NO
JESD-30 code	S-PQFP-G32	-	-	-	S-PQFP-G32	S-PQFP-G32	S-PQFP-G32
length	7 mm	-	-	-	7 mm	7 mm	7 mm
Humidity sensitivity level	3	-	-	-	3	3	3
Number of I/O lines	24	-	-	-	24	24	24
Number of terminals	32	-	-	-	32	32	32
Maximum operating temperature	85 °C	-	-	-	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-	-	-20 °C	-20 °C	-40 °C
PWM channel	NO	-	-	-	NO	NO	NO
Package body material	PLASTIC/EPOXY	-	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	-	-	-	LQFP	LQFP	LQFP
Encapsulate equivalent code	QFP32,.35SQ,32	-	-	-	QFP32,.35SQ,32	QFP32,.35SQ,32	QFP32,.35SQ,32
Package shape	SQUARE	-	-	-	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE	-	-	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	260	-	-	-	260	260	260
power supply	3/5 V	-	-	-	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	-	-	-	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	1024	-	-	-	512	768	512
rom(word)	16384	-	-	-	8192	12288	8192
ROM programmability	FLASH	-	-	-	FLASH	FLASH	FLASH
Maximum seat height	1.7 mm	-	-	-	1.7 mm	1.7 mm	1.7 mm
speed	16 MHz	-	-	-	16 MHz	16 MHz	16 MHz
Maximum slew rate	14 mA	-	-	-	14 mA	14 mA	14 mA
Maximum supply voltage	5.5 V	-	-	-	5.5 V	5.5 V	5.5 V
Minimum supply voltage	3 V	-	-	-	3 V	3 V	3 V
Nominal supply voltage	5 V	-	-	-	5 V	5 V	5 V
surface mount	YES	-	-	-	YES	YES	YES
technology	CMOS	-	-	-	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	-	-	OTHER	OTHER	INDUSTRIAL
Terminal form	GULL WING	-	-	-	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	-	-	-	0.8 mm	0.8 mm	0.8 mm
Terminal location	QUAD	-	-	-	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	-	-	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7 mm	-	-	-	7 mm	7 mm	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	-	-	-	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

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