EEWORLDEEWORLDEEWORLD

Part Number

Search

C0603C508D8GACTM

Description
CAPACITOR, CERAMIC, MULTILAYER, 10V, C0G, 0.0000005uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size1MB,9 Pages
ManufacturerKEMET
Websitehttp://www.kemet.com
Environmental Compliance  
Download Datasheet Parametric View All

C0603C508D8GACTM Overview

CAPACITOR, CERAMIC, MULTILAYER, 10V, C0G, 0.0000005uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT

C0603C508D8GACTM Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instruction, 0603
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance5e-7 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.8 mm
JESD-609 codee3
length1.6 mm
Manufacturer's serial numberC
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance100%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingBULK CASSETTE; TR, PUNCHED PAPER, 7/13 INCH
positive tolerance100%
Rated (DC) voltage (URdc)10 V
seriesC(SIZE)C(C0G)
size code0603
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
width0.8 mm
Base Number Matches1
CERAMIC CHIP CAPACITORS
FEATURES
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
• Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
• RoHS Compliant
CAPACITOR OUTLINE DRAWINGS
W
T
S
ELECTRODES
L
B
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
DIMENSIONS—MILLIMETERS AND (INCHES)
SIZE CODE
EIA
SIZE
SIZE
CODE
METRIC
(Ref only)
CODE
SIZE CODE
0402*
1005
EIA
METRIC
L - LENGTH
0.6 (.024) ± .03 (.001)
1.0 (.04) ± .05 (.002)
1.6 (.063) ± .15 (.006)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .20 (.008)
3.2 (.126) ± .20 (.008)
4.5 (.177) ± .30 (.012)
4.5 (.177) ± .30 (.012)
5.6 (.220) ± .40 (.016)
5.6 (.220) ± .40 (.016)
W - WIDTH
0.3 ± (.012) ± .03 (.001)
0.5 (.02) ± .05 (.002)
0.8 (.032) ± .15 (.006)
1.25 (.049) ± .20 (.008)
1.6 (.063) ± .20 (.008)
2.5 (.098) ± .20 (.008)
3.2 (.126) ± .30 (.012)
6.4 (.252) ± .40 (.016)
5.0 (.197) ± .40 (.016)
6.3 (.248) ± .40 (.016)
T
THICKNESS
B - BANDWIDTH
0.15 (.006) ± .05 (.002)
0.20 (.008) -.40 (.016)
0.35 (.014) ± .15 (.006)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
S
SEPARATION
minimum
N/A
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
or
0201*
0603*
0402*
0805*
0603
1206*
0805*
1210*
1206*
1812
2220
2225
1812
0603
1608
1005
2012
1608
3216
2012
3225
3216
4532
4564
5650
5664
4532
4564
5650
5664
1210*
1825*
1825*
2220
2225
3225
See page 78
for thickness
dimensions.
Solder Wave +
or
Solder Reflow
Solder
Reflow
Solder Reflow
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
CAPACITOR ORDERING INFORMATION
(Standard Chips - For
C 0805 C 103 K 5 R A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
D – ±0.5pF
M – ±20%
F – ±1%
P – (GMV) – special order only
G – ±2%
Z – +80%, -20%
72
Military see page
87)
END METALLIZATION
C-Standard (Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)
V – Y5V (+22%, -82%) (-30°C + 85°C)
VOLTAGE
1
- 100V
1
- 100V 3 - 25V
25V
3-
2 - 200V 4 - 16V
2
- 50V 8 - 10V
16V
- 200V
4-
5
5
- 35V 9 - 6.3V
10V
8-
6
- 50V
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)
7 - 4V
- 6.3V
7 - 4V
9
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Ceramic Surface Mount
02Power on and program download and debugging
Power on I found a miniUSB data cable to connect to the link debugging interface, and I found that L_LED2 was flashing, and LED1 to LED4 were lighting up in a cycle. It can be seen that the program cu...
秦天qintian0303 GD32 MCU
[APM32E103VET6S MINI development board with JHIHAI M3 core] 04. Sleep, stop, standby mode and wake-up function
When making some low-power products or some products need to save power, we will put the MCU into low-power mode when it is not processing application tasks to extend the battery life; APM32E103VET6S ...
xld0932 Domestic Chip Exchange
If I give you a...
infineno multicopter full systerm solution If you are given it, what will you do with it???...
okhxyyo Special Edition for Assessment Centres
Research on FPGA Implementation of Multi-level Two-dimensional Integer Wavelet Transform.pdf
Research on FPGA Implementation of Multi-level Two-dimensional Integer Wavelet Transform.pdf...
zxopenljx EE_FPGA Learning Park
Reconfigurable or tunable microwave filter technology
Electronically reconfigurable, or electrically tunable, microwave filters are attracting increasing attention for research and development due to their growing importance in improving the capacity of ...
btty038 RF/Wirelessly
Relay contact protection circuit, switching power supply RCD circuit, MOS tube construction, several issues 1. Relay coil and RC series circuit...
Several issues on relay contact protection circuit, switching power supply RCD circuit, and MOS tube structure 1. The relay coil is connected in parallel with the RC series circuit to absorb the self-...
QWE4562009 Power technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号