Multilayer Ceramic Chip Capacitors
FEATURES
• CLASS II DIELECTRIC, TEMPERATURE STABLE
• EXCELLENT FREQUENCY CHARACTERISTICS, NON-LINEAR
CAPACITANCE CHANGE
• HIGHER CAPACITANCE THAN NPO
• NICKEL BARRIER
TERMINATIONS AND EXCELLENT
MECHANICAL STRENGTH
• EIA MARKING AVAILABLE
NMC Series X7R
RoHS
Compliant
0.0012
µ
F to 100
µF
±10%(K), ±20%(M)
-55
o
C to +85
o
C
*See Part Number System for Details
Capacitance Range
Capacitance Tolerances
Operating Temperature Range
Temperature Characteristics
Rated Voltages
Dissipation Factor
Insulation Resistance
Dielectric Withstanding Voltage
Test Conditions (EIA-198-2E)
±15%
∆
max. over temperature range (with 0 Vdc applied)
6.3Vdc, 10Vdc, 16Vdc, 25Vdc , 35Vdc, 50Vdc
C < 2.2
µ
F 5% max., C > 2.2
µ
F 10% max.
@ 1.0Vrms and KHz, +25 °C
10,000 Megohms min. or 100Meg ohm/
µ
F min. whichever is less @ 25°C
250% of Rated Voltage for 5 ±1 seconds, 50 milliamps maximum
1KHz, 1.0V ±0.2 Vrms
10000
Insulation Resistance
(Ω Farads)
Minimum Insulation Resistance
vs. Temperature
1000
100
10
10
25
Temperature °C
100 125
PART NUMBERING SYSTEM
NMC 0805 X7R 102 K 50 TRP or TRPLP F
Lead Free Terminations
(100% Sn optional)
Series
Tape & Reel (Embossed Plastic Carrier)
Tape & Reel (Paper carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, first 2 digits are
significant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
®
4
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com
Multilayer Ceramic Chip Capacitors
X7R CAPACITOR SIZE CHART (mm)
½½½ ½½½½ ½½½½
½½½½½½
½
½½½½½
½
½½½
½½½½½½ ½½½½½½ ½
½½½½½½½½½½½ ½½½½½ ½
½½½½½½½½½½½
½½½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½
µ½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½½½
½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½½
½½
½½
½½½½
½½½½½½½
½½½½½½½½
½½½½
½½½½½½½
½½ ½½
½½
½½
½½½½
½½½½½½½
½½½½½½½
½½½½
½½½½½½½
½½ ½½
½½½½
½½½½½½½
½½½½½½½
½½½½
½½½½½½½
½½½½½½½ ½½½½½½½ ½½½½½
½½ ½½
NMC Series X7R
½½½½
½½
½½½½½
½½½½½½½½
½½½½
½½½½½½½
½½½½
½½½½½½½
½½½½½½½½½
½½½½
½½½½½½½½
½½ ½½½
½½ ½½½ ½½
½½ ½½½ ½½
½½ ½½½ ½½
½½½½½ ½½½
µ½
½½½ ½½½½½½½½ ½½½½
½½
½
½½½½½½ ½ ½½½½½½ ½½½½½½½ ½½½½½½½½½ ½ ½½ ½½½½½½ ½½½½½½½ ½½½½½½½½
½
W
H
P
L
Sn-Pb solder plate finish over nickel
barrier over Cu base. Also available
with 100% Pb-free plating finish.
P
®
6
NIC COMPONENTS
www.niccomp.com
www.lowESR.com
www.RFpassives.com