OTP ROM, 16KX1, CMOS, PDSO8,
Parameter Name | Attribute value |
package instruction | SOP, |
Reach Compliance Code | unknown |
JESD-30 code | R-PDSO-G8 |
memory density | 16384 bit |
Memory IC Type | OTP ROM |
memory width | 1 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 16384 words |
character code | 16000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 16KX1 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 6 V |
Minimum supply voltage (Vsup) | 2.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | GULL WING |
Terminal location | DUAL |
Base Number Matches | 1 |
DS2505S-UNW | DS2506P-UNW | |
---|---|---|
Description | OTP ROM, 16KX1, CMOS, PDSO8, | OTP ROM, 8KX8, CMOS, PDSO6, |
Reach Compliance Code | unknown | unknown |
JESD-30 code | R-PDSO-G8 | R-PDSO-G6 |
memory density | 16384 bit | 65536 bit |
Memory IC Type | OTP ROM | OTP ROM |
memory width | 1 | 8 |
Number of functions | 1 | 1 |
Number of terminals | 8 | 6 |
word count | 16384 words | 8192 words |
character code | 16000 | 8000 |
Operating mode | ASYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C |
organize | 16KX1 | 8KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | SERIAL | SERIAL |
Certification status | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 6 V | 6 V |
Minimum supply voltage (Vsup) | 2.8 V | 2.8 V |
surface mount | YES | YES |
technology | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL |
Terminal form | GULL WING | GULL WING |
Terminal location | DUAL | DUAL |
Base Number Matches | 1 | 1 |