SRAM Module, 256KX32, 25ns, CMOS, PLASTIC, LEADLESS, SIMM-64
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | SIMM |
package instruction | SIMM, SSIM64 |
Contacts | 64 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.A |
Maximum access time | 25 ns |
Other features | USER CONFIGURABLE AS 1M X 8 |
Spare memory width | 16 |
I/O type | COMMON |
JESD-30 code | R-XSMA-N64 |
memory density | 8388608 bit |
Memory IC Type | SRAM MODULE |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 64 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX32 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | SIMM |
Encapsulate equivalent code | SSIM64 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 14.986 mm |
Maximum standby current | 0.08 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 1.44 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Base Number Matches | 1 |