MIC94060YC6 datasheet, PDF - EEWORLD Datasheet

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MIC94060YC6: DescriptionHigh Side Power Switches; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size853KB，11 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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MIC94060YC6 Overview

High Side Power Switches

MIC94060YC6 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microchip
package instruction	TSSOP, TSSOP6,.08
Reach Compliance Code	compli
ECCN code	EAR99
Built-in protection	TRANSIENT
Number of drives	1
Interface integrated circuit type	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 code	R-PDSO-G6
JESD-609 code	e4
length	2 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	6
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output current flow direction	SOURCE
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP6,.08
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.1 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	1.7 V
Nominal supply voltage	5 V
surface mount	YES
technology	MOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
Disconnect time	0.2 µs
connection time	1.5 µs
width	1.25 mm

MIC94060YC6 Related Products

	MIC94060YC6	MIC94060_07	MIC94061YC6	MIC94061YMT	MIC94062YC6	MIC94060YMT	MIC94063YC6	MIC94062YMT	MIC94063YMT
Description	High Side Power Switches	High Side Power Switches	High Side Power Switches	High Side Power Switches	High Side Power Switches	High Side Power Switches	High Side Power Switches	High Side Power Switches	High Side Power Switches
Is it Rohs certified?	conform to	-	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Microchip	-	Microchip	Microchip	Microchip	-	-	Microchip	-
package instruction	TSSOP, TSSOP6,.08	-	TSSOP, TSSOP6,.08	HVSON, SOLCC4,.06,20	TSSOP, TSSOP6,.08	HVSON, SOLCC4,.06,20	TSSOP, TSSOP6,.08	HVSON, SOLCC4,.06,20	HVSON, SOLCC4,.06,20
Reach Compliance Code	compli	-	compli	compli	compli	compli	compli	compli	compli
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Built-in protection	TRANSIENT	-	TRANSIENT	TRANSIENT	TRANSIENT	TRANSIENT	TRANSIENT	TRANSIENT	TRANSIENT
Number of drives	1	-	1	1	1	1	1	1	1
Interface integrated circuit type	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	-	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 code	R-PDSO-G6	-	R-PDSO-G6	R-PDSO-N4	R-PDSO-G6	R-PDSO-N4	R-PDSO-G6	R-PDSO-N4	R-PDSO-N4
JESD-609 code	e4	-	e4	e3	e4	e3	e4	e3	e3
length	2 mm	-	2 mm	1.6 mm	2 mm	1.6 mm	2 mm	1.6 mm	1.6 mm
Humidity sensitivity level	1	-	1	1	1	1	1	1	1
Number of functions	1	-	1	1	1	1	1	1	1
Number of terminals	6	-	6	4	6	4	6	4	4
Maximum operating temperature	85 °C	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output current flow direction	SOURCE	-	SOURCE	SOURCE	SOURCE	SOURCE	SOURCE	SOURCE	SOURCE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	-	TSSOP	HVSON	TSSOP	HVSON	TSSOP	HVSON	HVSON
Encapsulate equivalent code	TSSOP6,.08	-	TSSOP6,.08	SOLCC4,.06,20	TSSOP6,.08	SOLCC4,.06,20	TSSOP6,.08	SOLCC4,.06,20	SOLCC4,.06,20
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	-	260	260	260	260	260	260	260
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.1 mm	-	1.1 mm	0.6 mm	1.1 mm	0.6 mm	1.1 mm	0.6 mm	0.6 mm
Maximum supply voltage	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	1.7 V	-	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage	5 V	-	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	-	YES	YES	YES	YES	YES	YES	YES
technology	MOS	-	CMOS	CMOS	MOS	MOS	CMOS	MOS	CMOS
Temperature level	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Matte Tin (Sn)	Nickel/Palladium/Gold (Ni/Pd/Au)	Matte Tin (Sn)	Nickel/Palladium/Gold (Ni/Pd/Au)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	GULL WING	-	GULL WING	NO LEAD	GULL WING	NO LEAD	GULL WING	NO LEAD	NO LEAD
Terminal pitch	0.65 mm	-	0.65 mm	0.5 mm	0.65 mm	0.5 mm	0.65 mm	0.5 mm	0.5 mm
Terminal location	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	40	-	40	40	40	40	40	40	40
Disconnect time	0.2 µs	-	0.2 µs	0.2 µs	0.2 µs	0.2 µs	0.2 µs	0.2 µs	0.2 µs
connection time	1.5 µs	-	1.5 µs	1.5 µs	1200 µs	1.5 µs	1200 µs	1200 µs	1200 µs
width	1.25 mm	-	1.25 mm	1.2 mm	1.25 mm	1.2 mm	1.25 mm	1.2 mm	1.2 mm

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