CY7C1313AV18-167BZC datasheet, PDF

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CY7C1313AV18-167BZC: Description1MX18 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165; Categorystorage storage; File Size1MB，23 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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CY7C1313AV18-167BZC Overview

1MX18 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165

CY7C1313AV18-167BZC Parametric

Parameter Name	Attribute value
Parts packaging code	BGA
package instruction	13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
Contacts	165
Reach Compliance Code	unknown
Maximum access time	0.5 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
length	15 mm
memory density	18874368 bit
Memory IC Type	QDR SRAM
memory width	18
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX18
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Certification status	COMMERCIAL
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
Temperature level	COMMERCIAL
Terminal surface	NOT SPECIFIED
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	13 mm
Base Number Matches	1

CY7C1313AV18-167BZC Related Products

	CY7C1313AV18-167BZC	CY7C1313AV18-200BZC	CY7C1313AV18-250BZC
Description	1MX18 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165	1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165	1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
Parts packaging code	BGA	BGA	BGA
package instruction	13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
Contacts	165	165	165
Reach Compliance Code	unknown	unknown	unknown
Maximum access time	0.5 ns	0.45 ns	0.45 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165
length	15 mm	15 mm	15 mm
memory density	18874368 bit	18874368 bit	18874368 bit
Memory IC Type	QDR SRAM	QDR SRAM	QDR SRAM
memory width	18	18	18
Number of functions	1	1	1
Number of terminals	165	165	165
word count	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	1MX18	1MX18	1MX18
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	LBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	1.4 mm	1.4 mm	1.4 mm
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	NOT SPECIFIED	TIN LEAD	TIN LEAD
Terminal form	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
width	13 mm	13 mm	13 mm
Base Number Matches	1	1	1
Is it lead-free?	-	Contains lead	Contains lead
Is it Rohs certified?	-	incompatible	incompatible
JESD-609 code	-	e0	e0
Humidity sensitivity level	-	3	3
Peak Reflow Temperature (Celsius)	-	220	220
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED

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