Dual-Core Intel® Xeon®
Processor 5000 Series
Datasheet
May 2006
Document Number: 313079-001
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Copyright © 2004-2006, Intel Corporation.
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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
Contents
1
Introduction................................................................................................................. 9
1.1
Terminology ..................................................................................................... 11
1.2
State of Data .................................................................................................... 12
1.3
References ....................................................................................................... 12
Electrical Specifications ............................................................................................... 15
2.1
Front Side Bus and GTLREF ................................................................................ 15
2.2
Power and Ground Lands.................................................................................... 15
2.3
Decoupling Guidelines ........................................................................................ 16
2.3.1 VCC Decoupling...................................................................................... 16
2.3.2 VTT Decoupling ...................................................................................... 16
2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 16
2.4
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 16
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]) .................................. 17
2.4.2 Phase Lock Loop (PLL) and Filter .............................................................. 18
2.5
Voltage Identification (VID) ................................................................................ 19
2.6
Reserved or Unused Signals................................................................................ 21
2.7
Front Side Bus Signal Groups .............................................................................. 21
2.8
GTL+ Asynchronous and AGTL+ Asynchronous Signals ........................................... 23
2.9
Test Access Port (TAP) Connection....................................................................... 23
2.10 Mixing Processors.............................................................................................. 24
2.11 Absolute Maximum and Minimum Ratings ............................................................. 24
2.12 Processor DC Specifications ................................................................................ 25
2.12.1 VCC Overshoot Specification .................................................................... 31
2.12.2 Die Voltage Validation ............................................................................. 32
Mechanical Specifications............................................................................................. 33
3.1
Package Mechanical Drawings ............................................................................. 33
3.2
Processor Component Keepout Zones................................................................... 37
3.3
Package Loading Specifications ........................................................................... 37
3.4
Package Handling Guidelines............................................................................... 38
3.5
Package Insertion Specifications.......................................................................... 38
3.6
Processor Mass Specifications ............................................................................. 38
3.7
Processor Materials............................................................................................ 38
3.8
Processor Markings............................................................................................ 39
3.9
Processor Land Coordinates ................................................................................ 40
Land Listing ............................................................................................................... 43
4.1
Dual-Core Intel Xeon Processor 5000 Series Land Assignments ............................... 43
4.1.1 Land Listing by Land Name ...................................................................... 43
4.1.2 Land Listing by Land Number ................................................................... 52
Signal Definitions ...................................................................................................... 61
5.1
Signal Definitions .............................................................................................. 61
Thermal Specifications ................................................................................................ 69
6.1
Package Thermal Specifications ........................................................................... 69
6.1.1 Thermal Specifications ............................................................................ 69
6.1.2 Thermal Metrology ................................................................................. 75
6.2
Processor Thermal Features ................................................................................ 77
6.2.1 Thermal Monitor..................................................................................... 77
6.2.2 On-Demand Mode .................................................................................. 77
6.2.3 PROCHOT# Signal .................................................................................. 78
6.2.4 FORCEPR# Signal................................................................................... 78
6.2.5 THERMTRIP# Signal ............................................................................... 78
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3
4
5
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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
3
6.2.6
6.2.7
7
Tcontrol and Fan Speed Reduction ............................................................79
Thermal Diode........................................................................................79
Features ....................................................................................................................83
7.1
Power-On Configuration Options ..........................................................................83
7.2
Clock Control and Low Power States .....................................................................83
7.2.1 Normal State .........................................................................................84
7.2.2 HALT or Enhanced Powerdown States ........................................................84
7.2.3 Stop-Grant State ....................................................................................85
7.2.4 Enhanced HALT Snoop or HALT Snoop State,
Stop Grant Snoop State...........................................................................86
7.3
Enhanced Intel SpeedStep® Technology ...............................................................86
Boxed Processor Specifications .....................................................................................89
8.1
Introduction ......................................................................................................89
8.2
Mechanical Specifications ....................................................................................90
8.2.1 Boxed Processor Heat Sink Dimensions (CEK).............................................91
8.2.2 Boxed Processor Heat Sink Weight ............................................................99
8.2.3 Boxed Processor Retention Mechanism and
Heat Sink Support (CEK) .........................................................................99
8.3
Electrical Requirements ......................................................................................99
8.3.1 Fan Power Supply (Active CEK).................................................................99
8.3.2 Boxed Processor Cooling Requirements.................................................... 100
8.4
Boxed Processor Contents................................................................................. 101
Debug Tools Specifications ......................................................................................... 103
9.1
Debug Port System Requirements ...................................................................... 103
9.2
Target System Implementation.......................................................................... 103
9.2.1 System Implementation......................................................................... 103
9.3
Logic Analyzer Interface (LAI) .......................................................................... 103
9.3.1 Mechanical Considerations ..................................................................... 104
9.3.2 Electrical Considerations ........................................................................ 104
2-1
2-2
2-3
2-4
2-5
3-1
3-2
3-3
3-4
3-5
3-6
3-7
3-8
6-1
6-2
6-3
6-4
7-1
Phase Lock Loop (PLL) Filter Requirements............................................................18
Dual-Core Intel® Xeon® Processor 5000 Series (1066 MHz)
Load Current versus Time ...................................................................................27
Dual-Core Intel® Xeon® Processor 5000 Series (667 MHz) and
Dual-Core Intel® Xeon® Processor 5063 (MV) Load Current versus Time..................28
VCC Static and Transient Tolerance Load Lines ......................................................29
VCC Overshoot Example Waveform ......................................................................32
Processor Package Assembly Sketch.....................................................................33
Processor Package Drawing (Sheet 1 of 3) ............................................................34
Processor Package Drawing (Sheet 2 of 3) ............................................................35
Processor Package Drawing (Sheet 3 of 3) ............................................................36
Dual-Core Intel Xeon Processor 5000 Series Top-side Markings................................39
Dual-Core Intel Xeon Processor 5063 (MV) Top-side Markings..................................39
Processor Land Coordinates, Top View ..................................................................40
Processor Land Coordinates, Bottom View .............................................................41
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz)
Thermal Profiles A and B.....................................................................................71
Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profiles ...................73
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile ......................................75
Case Temperature (TCASE) Measurement Location.................................................76
Stop Clock State Machine....................................................................................85
8
9
Figures
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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
8-1
Boxed Dual-Core Intel Xeon Processor 5000 Series 1U
Passive/2U Active Combination Heat Sink (With Removable Fan) ............................. 89
8-2
Boxed Dual-Core Intel Xeon Processor 5000 Series 2U Passive Heat Sink .................. 90
8-3
2U Passive Dual-Core Intel Xeon Processor 5000 Series
Thermal Solution (Exploded View) ....................................................................... 90
8-4
Top Side Board Keep-Out Zones (Part 1) .............................................................. 92
8-5
Top Side Board Keep-Out Zones (Part 2) .............................................................. 93
8-6
Bottom Side Board Keep-Out Zones ..................................................................... 94
8-7
Board Mounting Hole Keep-Out Zones .................................................................. 95
8-8
Volumetric Height Keep-Ins ................................................................................ 96
8-9
4-Pin Fan Cable Connector (For Active CEK Heat Sink) ........................................... 97
8-10 4-Pin Base Board Fan Header (For Active CEK Heat Sink)........................................ 98
8-11 Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution ....................... 100
Tables
1-1
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
2-10
2-11
2-12
2-13
2-14
2-15
2-16
2-17
3-1
3-2
3-3
4-1
4-2
5-1
6-1
6-2
6-3
6-4
6-5
6-6
6-7
6-8
6-9
6-10
6-11
6-12
Dual-Core Intel® Xeon® Processor 5000 Series Features ....................................... 10
Core Frequency to FSB Multiplier Configuration ..................................................... 17
BSEL[2:0] Frequency Table ................................................................................ 17
Voltage Identification Definition........................................................................... 19
Loadline Selection Truth Table for LL_ID[1:0] ....................................................... 20
Market Segment Selection Truth Table for MS_ID[1:0] ........................................... 20
FSB Signal Groups............................................................................................. 22
Signal Description Table ..................................................................................... 23
Signal Reference Voltages .................................................................................. 23
Processor Absolute Maximum Ratings................................................................... 24
Voltage and Current Specifications....................................................................... 25
VCC Static and Transient Tolerance ..................................................................... 28
BSEL[2:0], VID[5:0] Signal Group DC Specifications .............................................. 30
AGTL+ Signal Group DC Specifications ................................................................. 30
PWRGOOD Input and TAP Signal Group DC Specifications ....................................... 30
GTL+ Asynchronous and AGTL+ Asynchronous Signal Group
DC Specifications .............................................................................................. 31
VTTPWRGD DC Specifications.............................................................................. 31
VCC Overshoot Specifications.............................................................................. 32
Package Loading Specifications ........................................................................... 37
Package Handling Guidelines............................................................................... 38
Processor Materials............................................................................................ 38
Land Listing by Land Name ................................................................................. 43
Land Listing by Land Number .............................................................................. 52
Signal Definitions .............................................................................................. 61
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Specifications ........ 70
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profile A Table ....... 71
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profile B Table ....... 72
Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Specifications .......... 72
Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profile A Table ......... 73
Dual-Core Intel Xeon 5000 Series (667 MHz) Thermal Profile B Table ....................... 74
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Specifications ........................... 74
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile Table ............................. 75
Thermal Diode Parameters using Diode Model ....................................................... 80
Thermal Diode Interface..................................................................................... 81
Thermal Diode Parameters using Transistor Model ................................................. 81
Parameters for Tdiode Correction Factor ............................................................... 81
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
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