WSF128K32-22H2I datasheet, PDF

WSF128K32-22H2I: DescriptionMemory Circuit, Flash+SRAM, 128KX32, CMOS, CPGA66, CERAMIC, HIP-66; Categorystorage storage; File Size505KB，12 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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WSF128K32-22H2I Overview

Memory Circuit, Flash+SRAM, 128KX32, CMOS, CPGA66, CERAMIC, HIP-66

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	CERAMIC, HIP-66
Reach Compliance Code	unknown
Maximum access time	120 ns
Other features	SRAM ORGANISATION IS 128K X 32
JESD-30 code	S-CPGA-P66
JESD-609 code	e0
length	35.18 mm
memory density	4194304 bit
Memory IC Type	MEMORY CIRCUIT
memory width	32
Mixed memory types	FLASH+SRAM
Number of functions	1
Number of terminals	66
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.7 mm
Maximum standby current	0.08 A
Maximum slew rate	0.67 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	35.18 mm
Base Number Matches	1

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