MC14412FP datasheet, PDF - EEWORLD Datasheet

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MC14412FP: DescriptionModem, 0.6kbps Data, CMOS, PDIP16, PLASTIC, DIP-16; CategoryWireless rf/communication Telecom circuit; File Size284KB，6 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MC14412FP Overview

Modem, 0.6kbps Data, CMOS, PDIP16, PLASTIC, DIP-16

MC14412FP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Other features	SIMPLEX; HALF DUPLEX; FULL DUPLEX
data rate	0.6 Mbps
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
length	19.175 mm
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5/15 V
Certification status	Not Qualified
Maximum seat height	4.44 mm
Maximum slew rate	27 mA
Nominal supply voltage	10 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	MODEM
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

MC14412FP Related Products

	MC14412FP	MC14412FL	MC14412VL	MC14412VP
Description	Modem, 0.6kbps Data, CMOS, PDIP16, PLASTIC, DIP-16	Modem, 0.6kbps Data, CMOS, CDIP16, CERAMIC, DIP-16	Modem, 0.6kbps Data, CMOS, CDIP16, CERAMIC, DIP-16	Modem, 0.6kbps Data, CMOS, PDIP16, PLASTIC, DIP-16
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
Other features	SIMPLEX; HALF DUPLEX; FULL DUPLEX	SIMPLEX; HALF DUPLEX; FULL DUPLEX	SIMPLEX; HALF DUPLEX; FULL DUPLEX	SIMPLEX; HALF DUPLEX; FULL DUPLEX
data rate	0.6 Mbps	0.6 Mbps	0.6 Mbps	0.6 Mbps
JESD-30 code	R-PDIP-T16	R-GDIP-T16	R-GDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0
length	19.175 mm	19.3 mm	19.3 mm	19.175 mm
Number of functions	1	1	1	1
Number of terminals	16	16	16	16
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5/15 V	5/15 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.44 mm	4.19 mm	4.19 mm	4.44 mm
Maximum slew rate	27 mA	27 mA	4.5 mA	4.5 mA
Nominal supply voltage	10 V	10 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	MODEM	MODEM	MODEM	MODEM
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	Tin/Lead (Sn/Pb)	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Base Number Matches	1	1	1	1

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