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TEA1069AH-T

Description
IC TELEPHONE MULTIFUNCTION CKT, PQFP44, PLASTIC, QFP-44, Telephone Circuit
CategoryWireless rf/communication    Telecom circuit   
File Size230KB,44 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

TEA1069AH-T Overview

IC TELEPHONE MULTIFUNCTION CKT, PQFP44, PLASTIC, QFP-44, Telephone Circuit

TEA1069AH-T Parametric

Parameter NameAttribute value
Parts packaging codeQFP
package instructionQFP,
Contacts44
Reach Compliance Codeunknown
Other features3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT
JESD-30 codeS-PQFP-G44
JESD-609 codee3
length10 mm
damage rate2:1
Number of functions1
Number of terminals44
Maximum operating temperature75 °C
Minimum operating temperature-25 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Certification statusNot Qualified
Maximum seat height2.1 mm
Nominal supply voltage2.7 V
surface mountYES
Telecom integrated circuit typesTELEPHONE MULTIFUNCTION CIRCUIT
Temperature levelCOMMERCIAL EXTENDED
Terminal surfaceTIN
Terminal formGULL WING
Terminal pitch0.8 mm
Terminal locationQUAD
width10 mm
Base Number Matches1

TEA1069AH-T Related Products

TEA1069AH-T TEA1069H-T TEA1069H TEA1069N TEA1069AH
Description IC TELEPHONE MULTIFUNCTION CKT, PQFP44, PLASTIC, QFP-44, Telephone Circuit IC TELEPHONE MULTIFUNCTION CKT, PQFP44, PLASTIC, QFP-44, Telephone Circuit IC TELEPHONE MULTIFUNCTION CKT, PQFP44, PLASTIC, QFP-44, Telephone Circuit IC TELEPHONE MULTIFUNCTION CKT, PDIP42, SHRINK, PLASTIC, DIP-42, Telephone Circuit IC TELEPHONE MULTIFUNCTION CKT, PQFP44, PLASTIC, QFP-44, Telephone Circuit
Parts packaging code QFP QFP QFP DIP QFP
package instruction QFP, QFP, PLASTIC, QFP-44 SHRINK, PLASTIC, DIP-42 QFP, QFP44,.5SQ,32
Contacts 44 44 44 42 44
Reach Compliance Code unknown unknown unknown unknown compliant
Other features 3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT 3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT 3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT 3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT 3:2 MAKE/BREAK RATIO IF OPTION DIODE PRESENT
JESD-30 code S-PQFP-G44 S-PQFP-G44 S-PQFP-G44 R-PDIP-T42 S-PQFP-G44
length 10 mm 10 mm 10 mm 38.65 mm 10 mm
damage rate 2:1 2:1 2:1 2:1 2:1
Number of functions 1 1 1 1 1
Number of terminals 44 44 44 42 44
Maximum operating temperature 75 °C 75 °C 75 °C 75 °C 75 °C
Minimum operating temperature -25 °C -25 °C -25 °C -25 °C -25 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP QFP QFP SDIP QFP
Package shape SQUARE SQUARE SQUARE RECTANGULAR SQUARE
Package form FLATPACK FLATPACK FLATPACK IN-LINE, SHRINK PITCH FLATPACK
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.1 mm 2.1 mm 2.1 mm 5.08 mm 2.1 mm
Nominal supply voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
surface mount YES YES YES NO YES
Telecom integrated circuit types TELEPHONE MULTIFUNCTION CIRCUIT TELEPHONE MULTIFUNCTION CIRCUIT TELEPHONE MULTIFUNCTION CIRCUIT TELEPHONE MULTIFUNCTION CIRCUIT TELEPHONE MULTIFUNCTION CIRCUIT
Temperature level COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 1.778 mm 0.8 mm
Terminal location QUAD QUAD QUAD DUAL QUAD
width 10 mm 10 mm 10 mm 15.24 mm 10 mm
Base Number Matches 1 1 1 1 1
JESD-609 code e3 e3 - - e3
Terminal surface TIN TIN - - TIN
Encapsulate equivalent code - - QFP44,.5SQ,32 SDIP42,.6 QFP44,.5SQ,32
technology - - BIPOLAR BIPOLAR BIPOLAR

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