AM29DL162CT70ECB datasheet, PDF

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AM29DL162CT70ECB: DescriptionFlash, 1MX16, 70ns, PDSO48, TSOP-48; Categorystorage storage; File Size775KB，55 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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AM29DL162CT70ECB Overview

Flash, 1MX16, 70ns, PDSO48, TSOP-48

AM29DL162CT70ECB Parametric

Parameter Name	Attribute value
Parts packaging code	TSOP
package instruction	TSOP1,
Contacts	48
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	70 ns
Spare memory width	8
startup block	TOP
JESD-30 code	R-PDSO-G48
length	18.4 mm
memory density	16777216 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
type	NOR TYPE
width	12 mm
Base Number Matches	1

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Am29DL16xC

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not recommended for designs. For new designs that do not

require simultaneous read/write (SRW) operations, the S29AL016D supersedes Am29DL16xC. For

new designs that require SRW, the S29JL032H supersedes Am29DL16xC. Please refer to the

Am29AL16xD and S29JL032H data sheets for specifications and ordering information. Availability

of this document is retained for reference and historical purposes only.

The following document contains information on Spansion memory products.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal data sheet improvement and are noted in the

document revision summary.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

21533

Revision

Amendment

Issue Date

September 7, 2007

D A T A

S H E E T

TABLE OF CONTENTS

Distinctive Characteristics . . . . . . . . . . . . . . . . . . 1

General Description . . . . . . . . . . . . . . . . . . . . . . . . 2

Simultaneous Read/Write Operations with Zero Latency ......... 2

Am29DL16xC Features ............................................................ 2

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5

Special Handling Instructions for FBGA Package ..................... 6

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29DL16xC Device Bus Operations ..............................10

DQ6: Toggle Bit I .................................................................... 29

Figure 6. Toggle Bit Algorithm........................................................ 29

DQ2: Toggle Bit II ................................................................... 30

Reading Toggle Bits DQ6/DQ2 ............................................... 30

DQ5: Exceeded Timing Limits ................................................ 30

DQ3: Sector Erase Timer ....................................................... 30

Table 15. Write Operation Status ................................................... 31

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 32

Figure 7. Maximum Negative Overshoot Waveform ...................... 32

Figure 8. Maximum Positive Overshoot Waveform........................ 32

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 33

Figure 9. I

CC1

Current vs. Time (Showing Active and

Automatic Sleep Currents) ............................................................. 34

Figure 10. Typical I

CC1

vs. Frequency ............................................ 34

Requirements for Reading Array Data ................................... 10

Writing Commands/Command Sequences ............................ 11

Simultaneous Read/Write Operations with Zero Latency ....... 11

Automatic Sleep Mode ........................................................... 11

RESET#: Hardware Reset Pin ............................................... 12

Output Disable Mode .............................................................. 12

Table 2. Am29DL16xC Device Bank Divisions ...............................12

Table 3. Sector Addresses for Top Boot Sector Devices ................13

SecSi Sector Addresses for Top Boot Devices.............................. 13

Table 5. Sector Addresses for Bottom Boot Sector Devices ...........14

SecSi Sector Addresses for Bottom Boot Devices......................... 14

Table 7. Am29DL16xC Autoselect Codes, (High Voltage Method) 15

Table 8. Top Boot Sector/Sector Block Addresses for

Protection/Unprotection ...................................................................16

Table 9. Bottom Boot Sector/Sector Block Addresses for Protec-

tion/Unprotection .............................................................................16

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 11. Test Setup.................................................................... 35

Figure 12. Input Waveforms and Measurement Levels ................. 35

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 36

Figure 13. Read Operation Timings ............................................... 36

Figure 14. Reset Timings ............................................................... 37

Word/Byte Configuration (BYTE#) .......................................... 38

Figure 15. BYTE# Timings for Read Operations............................ 38

Figure 16. BYTE# Timings for Write Operations............................ 38

Erase and Program Operations .............................................. 39

Figure 17. Program Operation Timings..........................................

Figure 18. Accelerated Program Timing Diagram..........................

Figure 19. Chip/Sector Erase Operation Timings ..........................

Figure 20. Back-to-back Read/Write Cycle Timings ......................

Figure 21. Data# Polling Timings (During Embedded Algorithms).

Figure 22. Toggle Bit Timings (During Embedded Algorithms)......

Figure 23. DQ2 vs. DQ6.................................................................

Write Protect (WP#) ................................................................ 17

Temporary Sector/Sector Block Unprotect ............................. 17

Figure 1. Temporary Sector Unprotect Operation........................... 17

Figure 2. In-System Sector/Sector Block Protect and

Unprotect Algorithms....................................................................... 18

Temporary Sector/Sector Block Unprotect ............................. 44

Figure 24. Temporary Sector/Sector Block Unprotect

Timing Diagram.............................................................................. 44

Figure 25. Sector/Sector Block Protect and Unprotect

Timing Diagram.............................................................................. 45

SecSi (Secured Silicon) Sector Flash Memory Region .......... 19

Hardware Data Protection ...................................................... 19

Common Flash Memory Interface (CFI) . . . . . . . 20

Table 10. CFI Query Identification String ........................................ 20

System Interface String................................................................... 21

Table 12. Device Geometry Definition ............................................ 21

Table 13. Primary Vendor-Specific Extended Query ...................... 22

Alternate CE# Controlled Erase and Program Operations ..... 46

Figure 26. Alternate CE# Controlled Write (Erase/Program)

Operation Timings.......................................................................... 47

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 23

Reading Array Data ................................................................ 23

Reset Command ..................................................................... 23

Autoselect Command Sequence ............................................ 23

Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 24

Byte/Word Program Command Sequence ............................. 24

Figure 3. Program Operation .......................................................... 25

Chip Erase Command Sequence ........................................... 25

Sector Erase Command Sequence ........................................ 25

Erase Suspend/Erase Resume Commands ........................... 26

Figure 4. Erase Operation............................................................... 26

Table 14. Am29DL16xC Command Definitions .............................. 27

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 28

DQ7: Data# Polling ................................................................. 28

Figure 5. Data# Polling Algorithm ................................................... 28

Erase And Programming Performance . . . . . . . 48

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 48

TSOP And SO Pin Capacitance . . . . . . . . . . . . . . 48

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 49

SSO056—56-Pin Shrink Small Outline Package (SSOP)

(measured in millimeters) ....................................................... 49

FBC048—48-Ball Fine-Pitch Ball Grid Array (FBGA)

8 x 9 mm (measured in millimeters) ........................................ 50

TS 048—48-Pin Standard TSOP (measured in millimeters) .. 51

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52

Revision B .............................................................................. 52

Revision B+1 .......................................................................... 52

Revision C .............................................................................. 52

Revision C1 (May 8, 2006) ..................................................... 52

Revision C2 (September 7, 2007) .......................................... 52

September 7, 2007 21533C2

Am29DL16xC

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