UVPROM, 256KX8, 300ns, CMOS, CDIP32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP32,.6 |
Reach Compliance Code | unknown |
Maximum access time | 300 ns |
I/O type | COMMON |
JESD-30 code | R-XDIP-T32 |
JESD-609 code | e0 |
memory density | 2097152 bit |
Memory IC Type | UVPROM |
memory width | 8 |
Number of terminals | 32 |
word count | 262144 words |
character code | 256000 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 256KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP32,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.06 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Base Number Matches | 1 |