IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate
Parameter Name | Attribute value |
Parts packaging code | DIE |
package instruction | , |
Reach Compliance Code | unknown |
series | HC/UH |
JESD-30 code | X-XUUC-N |
Logic integrated circuit type | BUFFER |
Number of functions | 9 |
Number of entries | 1 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
Output characteristics | OPEN-DRAIN |
Package body material | UNSPECIFIED |
Package shape | UNSPECIFIED |
Package form | UNCASED CHIP |
propagation delay (tpd) | 165 ns |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 6 V |
Minimum supply voltage (Vsup) | 2 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal form | NO LEAD |
Terminal location | UPPER |
Base Number Matches | 1 |
933987850005 | 74HC9115U | 933987840118 | 933987840112 | 933987860112 | 933987870112 | 933987870118 | 933987880005 | 933987830112 | 74HCT9115U | |
---|---|---|---|---|---|---|---|---|---|---|
Description | IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate | IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate | IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate | IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate | IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDIP20, DIP-20, Gate | IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate | IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate | IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate | IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDIP20, DIP-20, Gate | IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate |
Parts packaging code | DIE | DIE | SOIC | SOIC | DIP | SOIC | SOIC | DIE | DIP | DIE |
package instruction | , | , | SO-20 | SO-20 | DIP, | SO-20 | SO-20 | , | DIP, | , |
Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
series | HC/UH | HC/UH | HC/UH | HC/UH | HCT | HCT | HCT | HCT | HC/UH | HCT |
JESD-30 code | X-XUUC-N | X-XUUC-N | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | X-XUUC-N | R-PDIP-T20 | X-XUUC-N |
Logic integrated circuit type | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
Number of functions | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
Number of entries | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Output characteristics | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
Package body material | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
Package shape | UNSPECIFIED | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | UNSPECIFIED |
Package form | UNCASED CHIP | UNCASED CHIP | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | UNCASED CHIP | IN-LINE | UNCASED CHIP |
propagation delay (tpd) | 165 ns | 165 ns | 165 ns | 165 ns | 47 ns | 47 ns | 47 ns | 47 ns | 165 ns | 47 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | 6 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 6 V | 5.5 V |
Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | 2 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 2 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | NO | YES | YES | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
Terminal form | NO LEAD | NO LEAD | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD | THROUGH-HOLE | NO LEAD |
Terminal location | UPPER | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL | UPPER |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
Is it lead-free? | - | - | Lead free | Lead free | Lead free | Lead free | Lead free | - | Lead free | - |
Is it Rohs certified? | - | - | conform to | conform to | conform to | conform to | conform to | - | conform to | - |
Maker | - | - | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP |
Contacts | - | - | 20 | 20 | 20 | 20 | 20 | - | 20 | - |
JESD-609 code | - | - | e4 | e4 | e4 | e4 | e4 | - | e4 | - |
length | - | - | 12.8 mm | 12.8 mm | 26.73 mm | 12.8 mm | 12.8 mm | - | 26.73 mm | - |
Number of terminals | - | - | 20 | 20 | 20 | 20 | 20 | - | 20 | - |
encapsulated code | - | - | SOP | SOP | DIP | SOP | SOP | - | DIP | - |
Peak Reflow Temperature (Celsius) | - | - | 260 | 260 | 245 | 260 | 260 | - | 245 | - |
Maximum seat height | - | - | 2.65 mm | 2.65 mm | 4.2 mm | 2.65 mm | 2.65 mm | - | 4.2 mm | - |
Terminal surface | - | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | - |
Terminal pitch | - | - | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | - | 2.54 mm | - |
Maximum time at peak reflow temperature | - | - | 40 | 40 | 40 | 30 | 40 | - | 40 | - |
width | - | - | 7.5 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.5 mm | - | 7.62 mm | - |