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933987850005

Description
IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate
Categorylogic    logic   
File Size41KB,7 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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933987850005 Overview

IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate

933987850005 Parametric

Parameter NameAttribute value
Parts packaging codeDIE
package instruction,
Reach Compliance Codeunknown
seriesHC/UH
JESD-30 codeX-XUUC-N
Logic integrated circuit typeBUFFER
Number of functions9
Number of entries1
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristicsOPEN-DRAIN
Package body materialUNSPECIFIED
Package shapeUNSPECIFIED
Package formUNCASED CHIP
propagation delay (tpd)165 ns
Certification statusNot Qualified
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formNO LEAD
Terminal locationUPPER
Base Number Matches1

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Description IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDIP20, DIP-20, Gate IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, PDSO20, SO-20, Gate IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate IC HC/UH SERIES, 9 1-INPUT NON-INVERT GATE, PDIP20, DIP-20, Gate IC HCT SERIES, 9 1-INPUT NON-INVERT GATE, UUC, DIE, Gate
Parts packaging code DIE DIE SOIC SOIC DIP SOIC SOIC DIE DIP DIE
package instruction , , SO-20 SO-20 DIP, SO-20 SO-20 , DIP, ,
Reach Compliance Code unknown unknow unknown unknown unknown unknown unknown unknown unknown unknown
series HC/UH HC/UH HC/UH HC/UH HCT HCT HCT HCT HC/UH HCT
JESD-30 code X-XUUC-N X-XUUC-N R-PDSO-G20 R-PDSO-G20 R-PDIP-T20 R-PDSO-G20 R-PDSO-G20 X-XUUC-N R-PDIP-T20 X-XUUC-N
Logic integrated circuit type BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER
Number of functions 9 9 9 9 9 9 9 9 9 9
Number of entries 1 1 1 1 1 1 1 1 1 1
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
Package body material UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED
Package shape UNSPECIFIED UNSPECIFIED RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR UNSPECIFIED RECTANGULAR UNSPECIFIED
Package form UNCASED CHIP UNCASED CHIP SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE UNCASED CHIP IN-LINE UNCASED CHIP
propagation delay (tpd) 165 ns 165 ns 165 ns 165 ns 47 ns 47 ns 47 ns 47 ns 165 ns 47 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 6 V 6 V 6 V 6 V 5.5 V 5.5 V 5.5 V 5.5 V 6 V 5.5 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V 2 V 4.5 V 4.5 V 4.5 V 4.5 V 2 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES NO YES YES YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form NO LEAD NO LEAD GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING NO LEAD THROUGH-HOLE NO LEAD
Terminal location UPPER UPPER DUAL DUAL DUAL DUAL DUAL UPPER DUAL UPPER
Base Number Matches 1 1 1 1 1 1 1 1 1 -
Is it lead-free? - - Lead free Lead free Lead free Lead free Lead free - Lead free -
Is it Rohs certified? - - conform to conform to conform to conform to conform to - conform to -
Maker - - NXP NXP NXP NXP NXP NXP NXP NXP
Contacts - - 20 20 20 20 20 - 20 -
JESD-609 code - - e4 e4 e4 e4 e4 - e4 -
length - - 12.8 mm 12.8 mm 26.73 mm 12.8 mm 12.8 mm - 26.73 mm -
Number of terminals - - 20 20 20 20 20 - 20 -
encapsulated code - - SOP SOP DIP SOP SOP - DIP -
Peak Reflow Temperature (Celsius) - - 260 260 245 260 260 - 245 -
Maximum seat height - - 2.65 mm 2.65 mm 4.2 mm 2.65 mm 2.65 mm - 4.2 mm -
Terminal surface - - NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD - NICKEL PALLADIUM GOLD -
Terminal pitch - - 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm - 2.54 mm -
Maximum time at peak reflow temperature - - 40 40 40 30 40 - 40 -
width - - 7.5 mm 7.5 mm 7.62 mm 7.5 mm 7.5 mm - 7.62 mm -

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