Multiplexer, 2-Func, 4 Line Input, TTL, CDIP16,
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | compliant |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Logic integrated circuit type | MULTIPLEXER |
Humidity sensitivity level | 2A |
Number of functions | 2 |
Number of entries | 4 |
Number of terminals | 16 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | 250 |
power supply | 5 V |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
Base Number Matches | 1 |
9309DCQM | 5962-01-011-2026 | 9309DMQB | 9309PCQR | 9309DCQR | 5962-01-025-9345 | |
---|---|---|---|---|---|---|
Description | Multiplexer, 2-Func, 4 Line Input, TTL, CDIP16, | Multiplexer, 2-Func, 4 Line Input, TTL, CDIP16, | Multiplexer, 2-Func, 4 Line Input, TTL, CDIP16, | Multiplexer, 2-Func, 4 Line Input, TTL, PDIP16, | Multiplexer, 2-Func, 4 Line Input, TTL, CDIP16, | Multiplexer, 2-Func, 4 Line Input, TTL, CDFP16, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | compliant | compli | compliant | compliant | compliant | compliant |
JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDFP-F16 |
Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 |
Number of entries | 4 | 4 | 4 | 4 | 4 | 4 |
Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DFP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | YES |
technology | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Is it lead-free? | Contains lead | Contains lead | - | Contains lead | Contains lead | Contains lead |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | - | - | DIP, DIP16,.3 | DFP, FL16,.3 |
JESD-609 code | e0 | - | e0 | e0 | e0 | - |
Humidity sensitivity level | 2A | 2A | - | 2A | 2A | 2A |
Peak Reflow Temperature (Celsius) | 250 | 250 | - | 250 | 250 | 250 |
Certification status | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Maximum time at peak reflow temperature | 30 | 30 | - | 30 | 30 | 30 |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |