IDT70125S55J datasheet, PDF - EEWORLD Datasheet

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IDT70125S55J: DescriptionDual-Port SRAM, 2KX9, 55ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52; Categorystorage storage; File Size166KB，12 Pages; ManufacturerIDT (Integrated Device Technology)

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IDT70125S55J Overview

Dual-Port SRAM, 2KX9, 55ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52

IDT70125S55J Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	LCC
package instruction	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
Contacts	52
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	55 ns
Other features	INTERRUPT FLAG; AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	S-PQCC-J52
JESD-609 code	e0
length	19.1262 mm
memory density	18432 bit
Memory IC Type	DUAL-PORT SRAM
memory width	9
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	52
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX9
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.57 mm
Maximum standby current	0.015 A
Minimum standby current	2 V
Maximum slew rate	0.24 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	19.1262 mm
Base Number Matches	1

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Description	Dual-Port SRAM, 2KX9, 55ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 2KX9, 55ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 2KX9, 45ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 2KX9, 35ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 2KX9, 25ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 2KX9, 45ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 2KX9, 35ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 2KX9, 55ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 2KX9, 35ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 2KX9, 25ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	LCC	LCC	LCC	LCC	LCC	LCC	LCC	LCC	LCC	LCC
package instruction	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52
Contacts	52	52	52	52	52	52	52	52	52	52
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	55 ns	55 ns	45 ns	35 ns	25 ns	45 ns	35 ns	55 ns	35 ns	25 ns
Other features	INTERRUPT FLAG; AUTOMATIC POWER-DOWN	INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP	INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP	INTERRUPT FLAG; AUTOMATIC POWER-DOWN	INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP	INTERRUPT FLAG; AUTOMATIC POWER-DOWN	INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP	INTERRUPT FLAG; AUTOMATIC POWER-DOWN	INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP	INTERRUPT FLAG; AUTOMATIC POWER-DOWN
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm
memory density	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit	18432 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	9	9	9	9	9	9	9	9	9	9
Humidity sensitivity level	3	3	1	3	3	1	3	3	3	3
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of ports	2	2	2	2	2	2	2	2	2	2
Number of terminals	52	52	52	52	52	52	52	52	52	52
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9	2KX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ	QCCJ
Encapsulate equivalent code	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ	LDCC52,.8SQ
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225	225	225	225	225
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm	4.57 mm
Maximum standby current	0.015 A	0.005 A	0.015 A	0.015 A	0.005 A	0.015 A	0.005 A	0.015 A	0.015 A	0.015 A
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	0.24 mA	0.2 mA	0.205 mA	0.25 mA	0.22 mA	0.245 mA	0.21 mA	0.24 mA	0.21 mA	0.26 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
Terminal form	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	30	30	30	30	30	30	30	30	30
width	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm	19.1262 mm
Base Number Matches	1	1	1	1	1	1	1	1	1	-
Maker	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)

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