Flash Card, 4GX8, PBGA153, FBGA-153
Parameter Name | Attribute value |
package instruction | FBGA-153 |
Reach Compliance Code | unknown |
JESD-30 code | R-PBGA-B153 |
memory density | 34359738368 bit |
Memory IC Type | FLASH CARD |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 153 |
word count | 4294967296 words |
character code | 4000000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -25 °C |
organize | 4GX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Programming voltage | 2.7 V |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
surface mount | YES |
technology | CMOS |
Temperature level | OTHER |
Terminal form | BALL |
Terminal location | BOTTOM |
type | NAND TYPE |
Base Number Matches | 1 |
FEMC004GMFG5-D14-10 | FEMC064GMFE6-D11-40 | FEMC016GMFE6-D11-10 | FEMC004GMFG5-D12-13 | |
---|---|---|---|---|
Description | Flash Card, 4GX8, PBGA153, FBGA-153 | Flash Card, 64GX8, PBGA169, FBGA-169 | Flash Card, 16GX8, PBGA169, FBGA-169 | Flash Card, 4GX8, PBGA169, FBGA-169 |
package instruction | FBGA-153 | FBGA-169 | FBGA-169 | FBGA-169 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
JESD-30 code | R-PBGA-B153 | R-PBGA-B169 | R-PBGA-B169 | R-PBGA-B169 |
memory density | 34359738368 bit | 549755813888 bit | 137438953472 bit | 34359738368 bit |
Memory IC Type | FLASH CARD | FLASH CARD | FLASH CARD | FLASH CARD |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 153 | 169 | 169 | 169 |
word count | 4294967296 words | 68719476736 words | 17179869184 words | 4294967296 words |
character code | 4000000000 | 64000000000 | 16000000000 | 4000000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -25 °C | -40 °C | -40 °C | -25 °C |
organize | 4GX8 | 64GX8 | 16GX8 | 4GX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA | BGA | BGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Programming voltage | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | OTHER | INDUSTRIAL | INDUSTRIAL | OTHER |
Terminal form | BALL | BALL | BALL | BALL |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
type | NAND TYPE | NAND TYPE | NAND TYPE | NAND TYPE |
Base Number Matches | 1 | 1 | 1 | 1 |