NAND Gate, TTL, CDFP14,
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
package instruction | DFP, FL14,.3 |
Reach Compliance Code | compliant |
JESD-30 code | R-XDFP-F14 |
JESD-609 code | e0 |
Logic integrated circuit type | NAND GATE |
MaximumI(ol) | 0.048 A |
Humidity sensitivity level | 2A |
Number of terminals | 14 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | DFP |
Encapsulate equivalent code | FL14,.3 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | 250 |
power supply | 5 V |
Maximum supply current (ICC) | 14.6 mA |
Prop。Delay @ Nom-Sup | 17 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
Base Number Matches | 1 |
9009FC | 9009DC | 9009DM | |
---|---|---|---|
Description | NAND Gate, TTL, CDFP14, | NAND Gate, TTL, CDIP14, | NAND Gate, TTL, CDIP14, |
Is it lead-free? | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible |
package instruction | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | compliant | compliant | compliant |
JESD-30 code | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 |
JESD-609 code | e0 | e0 | e0 |
Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE |
MaximumI(ol) | 0.048 A | 0.048 A | 0.048 A |
Humidity sensitivity level | 2A | 2A | 2A |
Number of terminals | 14 | 14 | 14 |
Maximum operating temperature | 70 °C | 70 °C | 125 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC |
encapsulated code | DFP | DIP | DIP |
Encapsulate equivalent code | FL14,.3 | DIP14,.3 | DIP14,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | 250 | 250 | 250 |
power supply | 5 V | 5 V | 5 V |
Maximum supply current (ICC) | 14.6 mA | 14.6 mA | 14.6 mA |
Prop。Delay @ Nom-Sup | 17 ns | 17 ns | 17 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Schmitt trigger | NO | NO | NO |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
surface mount | YES | NO | NO |
technology | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | 30 | 30 |
Base Number Matches | 1 | 1 | 1 |