WF2M32BI-150HC5 datasheet, PDF

WF2M32BI-150HC5: DescriptionFlash Module, 8MX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66; Categorystorage storage; File Size328KB，12 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WF2M32BI-150HC5 Overview

Flash Module, 8MX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	PGA
package instruction	PGA,
Contacts	66
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	150 ns
Other features	USER CONFIGURABLE AS 4M X 16 OR 2M X 32; 100000 WRITE/ERASE CYCLES MIN
JESD-30 code	S-CPGA-P66
JESD-609 code	e4
length	30.1 mm
memory density	67108864 bit
Memory IC Type	FLASH MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	6.22 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	GOLD
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	30.1 mm
Base Number Matches	1

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