MASK ROM, 1MX16, 150ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | TSOP2 |
| package instruction | TSOP2, TSOP44,.46,32 |
| Contacts | 44 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 150 ns |
| Spare memory width | 8 |
| JESD-30 code | R-PDSO-G44 |
| JESD-609 code | e0 |
| length | 18.41 mm |
| memory density | 16777216 bit |
| Memory IC Type | MASK ROM |
| memory width | 16 |
| Number of functions | 1 |
| Number of terminals | 44 |
| word count | 1048576 words |
| character code | 1000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP2 |
| Encapsulate equivalent code | TSOP44,.46,32 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.07 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
| Base Number Matches | 1 |
| K3N5C1000F-TC15 | K3N5C1000F-TC10 | K3N5C1000F-TC12 | |
|---|---|---|---|
| Description | MASK ROM, 1MX16, 150ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | MASK ROM, 1MX16, 100ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | MASK ROM, 1MX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Parts packaging code | TSOP2 | TSOP2 | TSOP2 |
| package instruction | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 |
| Contacts | 44 | 44 | 44 |
| Reach Compliance Code | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 150 ns | 100 ns | 120 ns |
| Spare memory width | 8 | 8 | 8 |
| JESD-30 code | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 |
| JESD-609 code | e0 | e0 | e0 |
| length | 18.41 mm | 18.41 mm | 18.41 mm |
| memory density | 16777216 bit | 16777216 bit | 16777216 bit |
| Memory IC Type | MASK ROM | MASK ROM | MASK ROM |
| memory width | 16 | 16 | 16 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 44 | 44 | 44 |
| word count | 1048576 words | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 | 1000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 1MX16 | 1MX16 | 1MX16 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP2 | TSOP2 | TSOP2 |
| Encapsulate equivalent code | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm |
| Maximum standby current | 0.00005 A | 0.00005 A | 0.00005 A |
| Maximum slew rate | 0.07 mA | 0.07 mA | 0.07 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 10.16 mm | 10.16 mm | 10.16 mm |
| Base Number Matches | 1 | 1 | 1 |
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